Temperature Equalization Component With Protrusion Housing

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Solution Overview

Problem

Existing temperature equalization components in electronic devices suffer from low heat dissipation efficiency due to the need for a copper block for heat conduction, which increases the thickness of the device and can lead to heat accumulation near the heating element.

Innovation Solution

A temperature equalization component with a housing and a capillary structure, where the housing includes a first protrusion part or depression part that allows direct contact with the heating element, eliminating the need for a copper block and enhancing heat conduction efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a copper block is used for heat conduction between the heating element and temperature equalization component, then heat transfer can be achieved, but heat dissipation efficiency is low and device thickness increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice thickness

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The patent removes the copper block from the heat transfer path, allowing the temperature equalization component to contact the heating element directly. This extraction of the intermediate copper block eliminates the additional thickness it adds to the device while improving heat dissipation efficiency through direct contact.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the functions of the copper block and the temperature equalization component by allowing direct contact between them. The housing of the temperature equalization component is designed with protrusion parts or depression parts that enable direct thermal contact with the heating element, combining the heat conduction function into a single integrated structure.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If a copper block is used for heat conduction, then thermal contact can be established, but heat accumulates near the heating element

Engineering Contradiction:

Improveheat transfer capabilityVSAvoidheat accumulation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

By removing the copper block from the system, the patent eliminates the thermal resistance interface between the copper block and the temperature equalization component. This direct contact configuration ensures more efficient heat transfer from the heating element, preventing heat accumulation in the intermediate layer.

Inventive Principle:

Principle #2Taking out (Extraction)

3Temperature

If direct contact between temperature equalization component and heating element is implemented, then heat dissipation efficiency improves, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent applies local quality by designing specific protrusion parts or depression parts on the housing of the temperature equalization component. These localized structural features enable direct contact with the heating element at specific points, achieving improved heat dissipation efficiency without requiring complex overall redesign of the component.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The direct contact between the temperature equalization component and the heating element improves heat transfer efficiency, reduces the probability of heat accumulation, and enhances the overall heat dissipation performance of the component.

Implementation Method 1

Heat emitted by the heating element can be absorbed by the temperature equalization component only after being conducted by the copper block

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The first protrusion part and/or the first depression part are/is configured to be in contact with a heating element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12336146B2Temperature equalization component and electronic device

Publication Date: 2025.06.17 HUAWEI TECH CO LTD

AI summary

A temperature equalization component and an electronic device are disclosed. The temperature equalization component may include a housing and a capillary structure. The housing may include a cavity, and the capillary structure is located in the cavity and is disposed on a side of the housing that faces a heating element. The housing is provided with a first protrusion part and/or a first depression part, and the temperature equalization component is in direct contact with the heating element by using the first protrusion part and/or the first depression part, thereby improving heat transfer efficiency, reducing a probability that heat accumulates around the heating element, and improving a heat dissipation effect of the temperature equalization component.