Temperature Measurement Accuracy via Elastic Bonding Agent
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Solution Overview
Problem
Existing temperature measuring apparatuses for substrates during processing lack accuracy, which can lead to inconsistent and potentially damaging heat treatments in semiconductor manufacturing.
Innovation Solution
A temperature measuring apparatus comprising a test substrate with a thermal conductivity, a circuit board layer with through holes and a bonding agent, and sensors positioned on the circuit board layer to measure temperature, where the bonding agent has thermal conductivity and elasticity, and the circuit board layer has a higher coefficient of thermal expansion than the test substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is directly bonded to a substrate or bonded via a circuit board, then the temperature can be measured, but the measurement accuracy is insufficient due to thermal conductivity mismatches and thermal expansion differences
Solution Approach 1:
An elastic bonding agent is introduced as an intermediary layer between the rigid circuit board and the substrate. This bonding agent has thermal conductivity greater than or equal to the substrate and matches the substrate's coefficient of thermal expansion, enabling efficient heat transfer from the substrate to the sensor while compensating for thermal expansion differences during heating/cooling cycles.
Solution Approach 2:
The patent changes the thermal parameters of the bonding system by selecting a bonding agent with specific thermal conductivity (≥ substrate) and coefficient of thermal expansion (matching substrate). This parameter optimization ensures both accurate heat transfer and dimensional stability under thermal stress, resolving the contradiction between measurement accuracy and reliability.
2Measurement precision
If the circuit board layer has a higher coefficient of thermal expansion than the test substrate, then thermal expansion differences can be compensated, but the bonding structure may experience stress during temperature changes
Solution Approach 1:
The patent deliberately designs the circuit board layer with a higher coefficient of thermal expansion than the substrate. During heating, this differential expansion allows the circuit board to expand more than the substrate, compensating for the substrate's expansion and maintaining bonding integrity. The elastic bonding agent accommodates this differential movement through its elasticity, preventing structure failure.
Solution Approach 2:
The elastic bonding agent acts as a flexible intermediate layer that can deform elastically to accommodate differential thermal expansion between the rigid circuit board and substrate. This flexibility prevents stress concentration and bonding failure while maintaining the structural integrity of the temperature measurement apparatus during temperature cycling.
3Adaptability or versatility
If multiple through holes are created in the circuit board layer for sensor placement, then temperature measurement capability is improved, but the structural integrity and thermal insulation of the circuit board is reduced
Solution Approach 1:
The circuit board layer is segmented with multiple through holes at specific locations to accommodate multiple temperature sensors. This segmentation allows independent temperature measurement at different positions on the substrate, providing versatile temperature profiling capability while maintaining sufficient structural integrity through the overall circuit board design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved temperature measurement accuracy by effectively transferring heat from the test substrate to the sensors through the bonding agent, while compensating for thermal expansion differences between the test and process substrates.
Implementation Method 1
a bonding agent disposed in the plurality of through holes and having a thermal conductivity
Implementation Method 2
a coefficient of thermal expansion of the circuit board layer is greater than a coefficient of thermal expansion of the test substrate
Data Source
AI summary
A temperature measuring apparatus with improved accuracy is provided. The temperature measuring apparatus comprises a test substrate having a thermal conductivity, a circuit board layer laminated on the test substrate and including a plurality of through holes exposing a top surface of the test substrate, bonding agent disposed in the plurality of through holes and having a thermal conductivity, and a plurality of sensors disposed on the bonding agent and for measuring a temperature.