Temperature-Sensing Probe for Semiconductor DUT Testing
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Solution Overview
Problem
The miniature scale of semiconductor devices under test (DUTs) complicates temperature sensing, as conventional methods require embedding thermistors, which becomes impractical due to the decreasing dimensions, leading to reduced testing accuracy and increased complexity.
Innovation Solution
A probing system with a manipulator and a temperature-sensing probe, where the probe includes a thermal conductive member and a temperature-sensing device, such as a thermistor or RTD, protruding from the manipulator to directly sense the surface temperature of the DUT, allowing for precise temperature measurement without contact and accommodating smaller DUTs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional embedding methods are used to sense temperature, then temperature sensing can be achieved, but it becomes impractical due to decreasing DUT dimensions and increased complexity
Solution Approach 1:
A thermal conductive member is introduced as an intermediary between the temperature-sensing device and the DUT. This member enhances thermal coupling and conductivity, enabling accurate temperature sensing without direct embedding in the DUT, thus reducing testing complexity while maintaining measurement precision
Solution Approach 2:
The invention replaces the mechanical embedding approach with a non-contact sensing method. The temperature-sensing device protrudes from the manipulator and senses temperature through the thermal conductive member without being embedded in the DUT, substituting a complex mechanical integration process with a simpler external sensing arrangement
2Productivity
If probe card is equipped with increasing numbers of probes to test multiple contact pads, then testing capacity increases, but accuracy of testing reduces due to increased complexity and power management issues
Solution Approach 1:
The testing system is segmented into multiple independent manipulators, each capable of handling a single probe. This allows parallel testing of multiple contact pads while maintaining simple, independent probe structures that avoid the power management and accuracy issues associated with densely packed probe cards
Solution Approach 2:
Each manipulator is designed as a universal, multi-functional unit that can perform both probing and temperature sensing functions. This multi-functionality reduces the need for specialized components and simplifies the overall system architecture, maintaining accuracy while enabling parallel testing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances testing accuracy by enabling direct temperature sensing above the DUT, reducing the impact of DUT dimensionality and allowing simultaneous temperature sensing and probing, improving the reliability of semiconductor device testing.
Implementation Method 1
the temperature-sensing device is surrounded by a thermal conductive member
Data Source
AI summary
A probing system includes a chuck configured to support a device under test (DUT); and a manipulator disposed above the chuck and including a first probe protruding from the manipulator toward the chuck, wherein the first probe includes a temperature-sensing device for sensing a temperature adjacent to a front surface of the DUT. A probing device includes a chuck; a DUT disposed over the chuck; a manipulator disposed above the DUT, wherein the manipulator includes a first probe protruding from the manipulator toward the DUT and including a temperature-sensing device for sensing a temperature, the DUT is moved toward the manipulator for sensing a temperature of the DUT by the first probe.