Temperature Adjusting Device for Uniform Chip Testing

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Solution Overview

Problem

Conventional chip testing apparatuses face reliability issues due to temperature inconsistencies within the testing environment, leading to unreliable testing results when chips are tested in high or low temperature settings.

Innovation Solution

A temperature adjusting device is designed for chip testing machines, featuring a main body with fluid channels and a pressing component that allows for precise temperature control, enabling each chip to exchange heat uniformly with a fluid at a predetermined temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a hot air blower is used to heat the oven for high temperature testing, then the chips can be tested in a high temperature environment, but the temperatures at different areas in the oven become different, leading to unreliable testing results

Engineering Contradiction:
Improvehigh temperature testing environmentVSAvoidtesting result reliability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent divides the testing system into multiple independent temperature control zones, with separate heating elements and temperature sensors for different regions. This segmentation allows each zone to be controlled independently, ensuring uniform temperature distribution across all testing areas and eliminating the temperature variation problem caused by single-point heating.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements local temperature control by placing multiple heating elements and sensors at different locations within the oven. Each heating element can be independently adjusted to provide the required temperature at its local zone, ensuring that all chips regardless of position experience the same predetermined temperature, thus improving testing reliability.

Inventive Principle:
Principle #3Local quality

2Temperature

If a freezer or cold room is used for low temperature testing, then the chips can be tested in a low temperature environment, but temperature inconsistencies still exist, leading to unreliable testing results

Engineering Contradiction:
Improvelow temperature testing environmentVSAvoidtesting result reliability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent applies the same segmentation principle to low temperature testing by dividing the cooling system into multiple independent zones with separate cooling elements and temperature sensors. This ensures that temperature can be uniformly controlled across different areas during low temperature testing, preventing the temperature variation issues that occur with single-point cooling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements local temperature control for low temperature environments by positioning multiple cooling elements and sensors throughout the testing chamber. Each local zone can be independently adjusted to maintain the predetermined low temperature, ensuring all chips experience consistent thermal conditions regardless of their position, thereby improving testing reliability.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures that each chip is tested at a consistent predetermined temperature, enhancing the accuracy of the testing results by maintaining uniformity across all chips during the testing operation.

Implementation Method 1

the fluid in the fluid accommodating slot is configured to exchange heat with the chip under test through the wall portion

Methodology Applied
Scientific EffectHeat exchange: Conduction (thermal)

Data Source

PatentUS11624776B2Temperature adjusting device
Publication Date: 2023.04.11 ONE TEST SYST
  • US11624776B2 patent drawing
  • US11624776B2 patent drawing
  • US11624776B2 patent drawing

AI summary

A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.