Temperature Adjustment Device for Semiconductor Substrate Uniformity
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Solution Overview
Problem
Variations in heat density within the heating element of electrostatic chucks in semiconductor manufacturing devices lead to uneven substrate temperatures, affecting the etching rate and yield of semiconductor devices.
Innovation Solution
A temperature adjustment device featuring a holding plate with a heating element, a base plate with through holes, and adjustment rods that allow for precise control of heat distribution by adjusting the position of the rods within the holes to optimize heat transfer and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heating element is incorporated in the electrostatic chuck plate to control substrate temperature, then the substrate temperature can be adjusted, but variations in heat density within the heating element cause uneven substrate temperature distribution
Solution Approach 1:
The base plate is divided into multiple regions with through-holes distributed across different areas. Adjustment rods are inserted into these through-holes to create segmented heat conduction paths, allowing independent control of heat distribution in different substrate regions. This segmentation enables correction of local temperature variations caused by non-uniform heating element heat density.
Solution Approach 2:
The adjustment rods are strategically positioned at specific locations where temperature correction is needed, based on the heat density distribution pattern of the heating element. By placing more adjustment rods in regions with higher heat density and fewer in regions with lower heat density, the system achieves local quality optimization - each region receives appropriate heat conduction adjustment to achieve overall temperature uniformity across the substrate.
2Manufacturing precision
If adjustment rods are inserted into through-holes in the base plate to control heat conduction, then temperature uniformity can be improved, but the device structure becomes more complex
Solution Approach 1:
Adjustment rods serve as intermediary heat conduction elements between the base plate and the electrostatic chuck plate. These rods mediate the heat flow, allowing indirect control of heat distribution without requiring direct modification of the heating element or the chuck plate structure. The rods act as adjustable thermal conductors that simplify the overall control mechanism while achieving precise temperature uniformity.
Solution Approach 2:
The positions of the adjustment rods within the through-holes can be adjusted to change the heat conduction parameters. By moving rods in and out or rotating them, the effective thermal conduction path length and cross-sectional area are modified, enabling dynamic adjustment of heat distribution. This parameter-based control provides flexibility without requiring complex mechanical or electronic control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables uniform temperature control of the substrate, improving the etching rate and yield of semiconductor devices by adjusting heat density and distribution effectively.
Implementation Method 1
a heating element capable of heating the processed substrate placed on the placing surface
Implementation Method 2
an adhesive layer that adheres the base plate and the holding plate
Data Source
AI summary
A temperature adjustment device includes a holding plate having a placing surface on which a processed substrate is placed. The holding plate includes a heating element capable of heating the processed substrate placed on the placing surface. A base plate that supports the holding plate includes first through holes extending through the base plate in a thickness direction. An adhesive layer, which adheres the base plate and the holding plate, includes second through holes that are respectively in communication with the first through holes. Adjustment rods are respectively inserted into the first through holes. Each of the adjustment rods includes a distal end located in a corresponding one of the second through holes.