Temperature-Calibrated Metrology for Hot Substrate Recipe Control
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Solution Overview
Problem
Metrology data collected at high temperatures during substrate processing in manufacturing systems is inaccurate and time-consuming to cool down for accurate measurements, leading to inefficiencies and increased latency.
Innovation Solution
Implement temperature-based metrology calibration using calibration factors or machine learning techniques to convert high-temperature metrology data to accurate lower-temperature data without waiting for substrates to cool down, enabling efficient and timely data collection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If metrology measurements are collected when the substrate is at high temperature, then measurement time is reduced, but measurement accuracy deteriorates
Solution Approach 1:
The patent applies parameter changes by transforming the temperature parameter of the substrate. Instead of waiting for the substrate to cool to a standard temperature for measurement, the system captures metrology data at the high temperature state and then applies temperature compensation algorithms to adjust the measurements to equivalent low-temperature values. This resolves the contradiction by changing the measurement approach from direct physical cooling to computational temperature correction.
Solution Approach 2:
The patent replaces the mechanical/physical cooling process with a computational system. Rather than using physical cooling mechanisms to bring the substrate to measurement temperature, the system uses machine learning models and algorithms to predict and compensate for temperature effects, substituting computational processing for physical thermal management.
2Measurement precision
If the substrate is cooled to lower temperature for accurate metrology measurements, then measurement accuracy is improved, but manufacturing throughput deteriorates
Solution Approach 1:
The patent applies preliminary action by capturing metrology measurements at high temperature immediately after processing, before cooling is required. The system performs the measurement action while the substrate is still hot, then subsequently applies computational corrections. This eliminates the need to wait for cooling while still achieving accurate results through post-processing temperature compensation.
Solution Approach 2:
The system changes the operational parameter from measuring at low temperature after cooling to measuring at high temperature with computational correction. This parameter change enables continuous processing without thermal management delays, maintaining both accuracy and throughput.
3Measurement precision
If temperature compensation algorithms are implemented, then measurement accuracy at high temperature is improved, but system complexity increases
Solution Approach 1:
The patent applies self-service by using the high-temperature metrology measurements themselves to train and improve the temperature compensation models. The system uses the captured data to automatically refine its own calibration, eliminating the need for separate manual calibration procedures and reducing overall system complexity despite the sophisticated algorithms involved.
Solution Approach 2:
The patent introduces temperature compensation algorithms as an intermediary between raw high-temperature measurements and final accurate results. These algorithms act as a computational mediator that translates hot-state measurements into equivalent cold-state values, adding minimal complexity while significantly improving measurement utility.
Data Source
AI summary
Methods and systems for temperature-based metrology calibration at a manufacturing system are provided. First metrology data corresponding to one or more first temperatures associated with a substrate following a completion of one or more portions of a substrate process at a manufacturing system is obtained. Second metrology data corresponding to a second temperature associated with the substrate following the completion of the substrate process is determined in view of calibration data associated with the substrate. The second temperature is different from each of the one or more first temperatures. In response to a determination, in view of the second metrology data, that a modification criterion associated with the substrate process is satisfied, the substrate process recipe is modified.