Temperature-Based Clock Control for Leakage-Aware Semiconductors

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Solution Overview

Problem

The increasing proportion of leakage power in semiconductor devices due to miniaturization, which significantly rises with temperature, poses a challenge in managing power consumption effectively, especially in communication terminals where temperature variations affect operating frequency and power usage.

Innovation Solution

A semiconductor device that adjusts its operating frequency based on temperature, switching to a higher frequency when the temperature exceeds a predetermined reference, thereby optimizing power reduction modes to minimize leakage and idle power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the operating frequency is increased to improve processing performance, then productivity is improved, but power consumption increases due to higher leakage current at elevated temperatures

Engineering Contradiction:
Improveprocessing performanceVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent applies dynamics by making the operating frequency adjustable based on temperature conditions. The frequency is dynamically switched between a first frequency (at lower temperatures) and a second frequency (at higher temperatures), allowing the system to adapt its performance and power consumption characteristics to match thermal conditions rather than operating at a fixed frequency

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the operating frequency parameter in response to temperature changes. When temperature exceeds a reference value, the system switches from the first frequency to the second frequency, thereby changing the operational parameters to balance performance and power consumption under varying thermal conditions

Inventive Principle:
Principle #35Parameter changes

2Productivity

If miniaturization is pursued to improve device integration, then productivity is improved, but leakage power increases due to smaller feature sizes

Engineering Contradiction:
Improvedevice integrationVSAvoidleakage power
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent implements feedback by monitoring the temperature of the semiconductor device and using this information to control the operating frequency. The temperature sensor provides continuous feedback about thermal conditions, and the controller adjusts the frequency accordingly, creating a closed-loop system that responds to actual device state

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system performs self-service by automatically adjusting its own operating parameters based on internal temperature measurements. The semiconductor device monitors its own thermal state and autonomously switches frequencies without external intervention, optimizing its own power consumption characteristics

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS10236890B2Semiconductor device and method for controlling the same
Publication Date: 2019.03.19 RENESAS ELECTRONICS CORP
  • US10236890B2 patent drawing
  • US10236890B2 patent drawing
  • US10236890B2 patent drawing

AI summary

A semiconductor device includes a mode determination unit configured to determine a power mode based on a temperature of the semiconductor device and a reference temperature, the power mode including one of a first mode which sets the operating frequency of the operation clock to be a first operating frequency and a second mode which sets the operating frequency of the operation clock to be a second operating frequency, and output a control signal according to the power mode to a clock generating unit.