Temperature control device, temperature control method, and inspection apparatus
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Solution Overview
Problem
Existing temperature control methods for semiconductor devices during inspection are inaccurate when the devices generate heat, particularly due to dynamic changes in heat transfer coefficients.
Innovation Solution
A temperature control device that includes a heating mechanism, temperature measurement, dynamic estimation, and control system to accurately estimate and adjust the temperature of the device using power supplied and vicinity temperature, with sliding mode and cooling mode controls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a heating mechanism and temperature control system are used to maintain temperature during inspection, then the temperature stability is improved, but the measurement precision deteriorates when the device generates significant heat
Solution Approach 1:
The patent introduces a thermal model as an intermediary between the heating mechanism and the temperature measurement. Instead of directly measuring and controlling temperature, the system uses a thermal model that calculates temperature based on power consumption data and thermal parameters. This mediator allows accurate temperature estimation without the measurement interference caused by the device's own heat generation during inspection
Solution Approach 2:
The patent replaces the traditional mechanical temperature measurement system (thermocouples, thermal sensors) with a computational thermal model. The thermal model uses electrical power consumption data and thermal parameters to calculate temperature, substituting direct physical measurement with mathematical modeling. This eliminates the measurement precision problems caused by the device's heat generation during inspection
2Measurement precision
If dynamic temperature estimation based on power consumption is implemented, then the temperature control accuracy is improved, but the device complexity increases
Solution Approach 1:
The patent implements a feedback mechanism where the thermal model continuously monitors power consumption data and adjusts temperature control in real-time. The system feeds back the calculated temperature estimates to the temperature control mechanism, creating a closed-loop control system that maintains high accuracy without requiring complex hardware modifications
Solution Approach 2:
The thermal model uses the device's own power consumption data during inspection to estimate its temperature. The system serves itself by utilizing already-available electrical measurement data (power consumption) to perform temperature estimation, eliminating the need for separate complex measurement systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise temperature control of semiconductor devices even under conditions of significant heat generation, ensuring accurate electrical characteristic inspections.
Implementation Method 1
a heating mechanism having a heating source configured to heat the target object
Implementation Method 2
a temperature measuring instrument configured to measure a vicinity temperature of the target object
Data Source
AI summary
This temperature control device for controlling the temperature of an object that is subject to temperature control is provided with: a heating mechanism which has a heat source for heating said object subject to temperature control; a temperature measuring instrument for measuring the peripheral temperature of said object subject to temperature control; a temperature estimation unit for dynamically estimating the temperature of said object subject to temperature control on the basis of power inputted to the heat source, power supplied to said object subject to temperature control, and the peripheral temperature; and a temperature controller for performing control on the temperature of said object subject to temperature control by controlling the power inputted to the heat source on the basis of the estimated temperature of said object subject to temperature control.