Temperature Control Device With Segmented Conductive Terminals
Solution Overview
Problem
The scaling of optical transceiver modules complicates the design and implementation of monitor photodiode (MPD) arrangements due to challenges in temperature regulation and electrical interconnection, particularly with EML lasers, which require precise voltage control and increased design complexity.
Innovation Solution
A temperature control device with at least two electrically conductive terminals that can provide different voltage potentials, allowing flexible electrical coupling to components like MPDs and laser diodes without the need for a negative voltage rail, reducing design complexity and circuitry footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single electrically conductive terminal is used in the temperature control device, then the device structure is simple, but it cannot provide different voltage potentials required by MPD and laser diode, increasing circuitry complexity externally
Solution Approach 1:
The temperature control device is segmented into multiple electrically conductive terminals (first terminal and second terminal) that are electrically isolated from each other. This segmentation allows each terminal to independently provide different voltage potentials, enabling flexible electrical coupling to multiple components such as MPD and laser diode without requiring external negative voltage rails.
2Adaptability or versatility
If multiple electrically isolated conductive terminals are provided on the temperature control device, then electrical coupling flexibility is improved, but the device complexity increases
Solution Approach 1:
The temperature control device is designed with multi-functional terminals that can serve multiple purposes. The first and second electrically conductive terminals can selectively couple to different components (MPD, laser diode, or both simultaneously) with different voltage potentials, making the device universally adaptable to various optical subassembly configurations without requiring complex external circuitry.
3Reliability
If EML lasers are used in optical transceiver modules, then transmission performance is improved, but the design complexity of MPD arrangements and temperature regulation increases
Solution Approach 1:
The temperature control device combines multiple functions into a single integrated component. It simultaneously provides temperature regulation for the EML laser and electrical coupling to the MPD through its multiple electrically conductive terminals. This merging eliminates the need for separate temperature control and electrical interconnection systems, reducing overall design complexity while maintaining high transmission performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient temperature regulation and operation of optical subassemblies by simplifying the electrical interconnection and reducing the complexity of power supply circuitry, accommodating various laser assembly configurations and enhancing the scalability of optical transceiver modules.
Implementation Method 1
a temperature control device for use in optical subassemblies... comprising a bottom plate to thermally couple to a heatsink, a top plate coupled to the bottom plate via a plurality of semiconductor elements disposed therebetween
Data Source
AI summary
In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.