Temperature control system and system of processing substrate
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Solution Overview
Problem
Conventional wafer processing apparatuses face issues such as increased installation cost, footprint, energy consumption, and maintenance complexity due to multiple chillers for temperature control in multiple processing modules, and lack the ability to independently control temperatures in different processing modules.
Innovation Solution
A single dual chiller system with two temperature control units and flow controllers is used to supply coolants of different temperatures to multiple processing modules, allowing independent temperature control of substrate supports in each module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple chillers are used for temperature control in multiple processing modules, then independent temperature control capability is improved, but installation cost, footprint, and device complexity increase
Solution Approach 1:
The patent merges multiple chillers into a single shared chiller system that serves multiple processing modules. The chiller includes multiple coolant supply lines that can independently deliver coolant to different modules, achieving both consolidation benefits and independent control capability.
Solution Approach 2:
The chiller system is segmented into multiple independent coolant supply lines, each capable of independently controlling coolant flow to specific processing modules. This segmentation allows independent temperature control while using a single integrated chiller unit.
2Measurement precision
If multiple chillers are used for temperature control in multiple processing modules, then temperature control precision is improved, but energy consumption increases
Solution Approach 1:
Multiple chillers are merged into a single chiller system, reducing the total energy consumption associated with running multiple independent cooling systems while maintaining the ability to precisely control temperatures in each processing module through independent coolant supply lines.
3Adaptability or versatility
If multiple chillers are used for temperature control in multiple processing modules, then temperature control capability is improved, but maintenance complexity increases
Solution Approach 1:
The patent consolidates multiple chillers into a single maintenance unit while preserving independent temperature control capability through multiple coolant supply lines. This reduces maintenance complexity by eliminating the need to maintain multiple separate chiller systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces installation costs, minimizes footprint, decreases energy consumption, and simplifies maintenance while enabling independent temperature control of multiple modules, improving thermal responsiveness and reducing temperature change times.
Implementation Method 1
a chiller connected to coolant paths within sample tables respectively disposed within these processing units, and configured to supply and circulate a coolant adjusted to a required temperature
Data Source
AI summary
A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.