Temperature-Dependent Movement Sensor Calibration via Conductive Thermal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing calibration methods for movement detection devices like accelerometers and gyroscopes introduce temperature-dependent errors due to physical contact or forced convection, making it difficult to isolate and correct measurement errors accurately.
Innovation Solution
A calibration system using a thermally conductive board structure with a thermal conduit and thermoelectric device that heats the device through conduction and convection, allowing for accurate temperature-dependent offset calibration without disturbing the sensors, by collecting data at multiple temperatures and storing it for later adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If physical contact or forced convection is used for calibration, then calibration can be performed, but temperature-dependent measurement errors are introduced
Solution Approach 1:
A thermal intermediary substance fills the enclosure space between the calibration heat source and the movement detection device. This intermediary enables thermal coupling for calibration while being configured to minimize unwanted thermal effects during normal operation, thus mediating between the need for thermal contact during calibration and the need for thermal isolation during measurement
Solution Approach 2:
The system dynamically changes the thermal coupling between the heat source and the movement detection device. During calibration, the enclosure allows thermal contact; during normal operation, the thermal effects are minimized. This dynamic adjustment resolves the contradiction between needing thermal contact for calibration and thermal isolation for accurate measurement
2Measurement precision
If the device is heated during calibration, then temperature-dependent errors can be calibrated, but the heating process may disturb the sensors
Solution Approach 1:
The thermal intermediary substance acts as a buffer that transmits heat during calibration while being configured to minimize thermal gradients and unwanted thermal effects. This intermediary enables accurate temperature-dependent calibration without directly disturbing the sensor with aggressive heating
Solution Approach 2:
The system carefully controls and changes temperature parameters during calibration, using the thermal intermediary to achieve smooth, controlled heating that allows accurate measurement of temperature-dependent errors without causing sensor disturbance from rapid or extreme temperature changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides highly accurate calibration by isolating temperature-related errors, ensuring precise sensor measurements for virtual, augmented, and mixed reality systems.
Implementation Method 1
a thermal conduit on the structural material, the thermal conduit having a thermal conductivity that is higher than a thermal conductivity of the structural material; a thermal path between the surface of the thermal interface and the electronics device
Implementation Method 2
a calibration system using a thermally conductive board structure with a thermal conduit and thermoelectric device that heats the device through conduction and convection
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
An electronics system comprising a board (12) that includes: a structural material (22); a thermal conduit on the structural material (22), the thermal conduit having a thermal conductivity that is higher than a thermal conductivity of the structural material and having a first region (46), a second region (48), and a connecting portion (40, 42) connecting the first region to the second region; a thermal interface (52) on the structural material (22), the thermal interface having a thermal heat transfer capacity that is higher than the thermal heat transfer capacity of the structural material (22) and being attached to the first region (38) of the thermal conduit; an electronics device (14) mounted to the board (12) at the second region (48) of the thermal conduit, the thermal conduit forming a thermal path between the surface of the thermal interface (52) and the electronics device (14); and a movement detection device (70, 72) in the electronics device (14); a system storage (18); and calibration data on the system storage (18), the calibration data including a first temperature of the movement detection device (70, 72); a first output from the movement detection device (70, 72) recorded against the first temperature; and a second temperature of the movement detection device (70, 72) that is different than the first temperature; and a second output from the movement detection device (70, 72) recorded against the second temperature.