Temperature measuring probe
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Solution Overview
Problem
Existing temperature measuring probes face challenges such as limited temperature range, non-linear temperature-frequency characteristics, frequency drift due to oxidation, high manufacturing costs, fragility, and difficulties in impedance matching, which restrict their application and reliability, especially in industrial settings.
Innovation Solution
A temperature measuring probe design featuring a hollow outer shell with a conductive section and an insulated handle, incorporating a plate-shaped sensor carrier made of insulating plastic, with ground conductor surfaces and signal conductor tracks that allow for flexible impedance matching and easy assembly, enabling the use of dipole antennas for improved reliability and automation, and accommodating multiple sensors without increasing the probe's diameter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If quartz crystal oscillators are used for temperature sensing, then temperature measurement is achieved, but the temperature range is limited to -40°C to +120°C and the frequency characteristic is highly non-linear
Solution Approach 1:
The patent changes the resonator material from quartz crystal to ceramic resonator, which fundamentally alters the temperature operating range and frequency characteristics. Ceramic resonators enable operation at higher temperatures and provide more linear temperature-frequency characteristics, directly resolving the contradiction between measurement capability and temperature range limitation.
2Reliability
If hermetic sealing with glass solder feedthrough is implemented, then frequency drift due to oxidation is prevented, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent extracts the hermetic sealing requirement by using a ceramic resonator that is inherently sealed and resistant to oxidation. The ceramic material itself provides the sealing function without requiring additional glass solder feedthroughs or vacuum sealing processes, thereby maintaining frequency stability while dramatically simplifying the manufacturing process.
Solution Approach 2:
The patent employs ceramic material that combines multiple functions: it serves as the resonator structure, provides hermetic sealing, and offers oxidation resistance. This composite approach eliminates the need for separate sealing components and complex assembly processes while maintaining the reliability benefits of hermetic sealing.
3Temperature
If thick-film ceramic circuit carriers are used, then high-temperature resistance is achieved, but the carriers are highly fragile and require precise positioning
Solution Approach 1:
The patent replaces the fragile thick-film ceramic circuit carrier with a more robust alternative that can withstand mechanical stresses. The new design uses materials and structures that are less susceptible to breaking from impact or bending, effectively trading the extreme high-temperature specialization for overall mechanical durability and ease of handling.
4Measurement precision
If multiple temperature sensors are arranged in the probe, then multi-point temperature monitoring is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent designs a universal sensor carrier structure that can accommodate multiple ceramic resonators of different types and frequency characteristics. This modular approach allows multi-point temperature monitoring while maintaining consistent manufacturing processes, as each sensor uses the same carrier design and mounting methodology, thereby avoiding the complexity increase that would result from custom mounting solutions for each sensor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust, reliable, and cost-effective temperature measurement system with a long service life, capable of operating in extreme conditions, including high temperatures, and supports precise temperature monitoring in both small and large-volume cooking environments with minimal manual intervention.
Implementation Method 1
at least one temperature sensor arranged in the electrically conductive temperature measuring probe and designed as a resonator
Data Source
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AI summary
The invention relates to a temperature measuring probe comprising a hollow temperature measuring lance, and at least one temperature sensor which is configured as a resonator and arranged in the temperature measuring lance, and which is/are connected to a communications unit for the wireless transmission of the temperature information. The object of the invention is to develop a temperature measuring probe which permits a design that is variable, is not influenced by an impedance adjustment, and fulfils the respective requirements of the user, and which itself guarantees a long service life with a high level of reliability, i.e. without changes to the temperature characteristic curve, under extreme operating conditions, as well as simultaneously guaranteeing a cost-effective, fully automatic manufacturing alongside an impedance adjustment that is simple from a manufacturing point of view. The temperature measuring probe according to the invention is characterised in that, inter alia, a plate-shaped sensor carrier (10) made of an electrically insulating plastic is arranged in the temperature measuring probe (1), and in that ground conductor surfaces (13) are arranged on both sides on the opposing surfaces (11) of said sensor carrier (10), which ground conductor surfaces function as a ground conductor (7) as a whole and are connected to one another via through-contacts (12) such that they are electrically conductive between one another, wherein free surfaces (14) are arranged in these ground conductor surfaces (13) on one or both sides of the sensor carrier (10), and in that signal conductor paths (15) are arranged in the centre of these free surfaces (14) at an electrically insulating distance from the ground conductor surfaces (13), wherein same are electrically conductively connected to one another via through-contacts (12), provided they are arranged on both sides on the opposing surfaces (11) of the sensor carrier (10), thereby forming the signal conductor (9) as a whole.