Integrated Temperature-Pressure Sensor With Thermowell Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing integrated temperature and pressure sensors face issues of high cost, low reliability, and inaccurate temperature response due to direct exposure of thermistors to the medium, which can cause short circuits and hinder heat transfer, and eccentric designs complicate manufacturing.
Innovation Solution
An integrated temperature and pressure sensor design featuring a metal tube with independent temperature and pressure sensing channels, a thermowell with a thermistor protected by a thermal conductive adhesive, and a circuit board connected through separate conductors, ensuring reliable signal transmission and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the thermistor is exposed to the medium for direct temperature sensing, then the temperature response time is improved, but the reliability deteriorates due to short circuit risks from conductive fibers in the medium
Solution Approach 1:
The patent introduces a thermowell as an intermediary component that allows the thermistor to sense temperature indirectly through its wall without direct exposure to the medium. This resolves the contradiction by maintaining reliability (no direct contact with conductive fibers) while still achieving temperature sensing functionality through thermal conduction from the medium to the thermowell and then to the thermistor.
2Reliability
If the thermistor is wrapped to protect it from the medium, then the reliability is improved, but the temperature response time deteriorates due to heat transfer barriers
Solution Approach 1:
The thermowell is designed with thin walls and specific thermal conductivity properties to optimize local heat transfer characteristics. The structure provides protection where needed (full enclosure of the thermistor) while maintaining excellent thermal coupling between the medium and the thermistor through the thermowell wall, thus achieving both reliability and fast response time.
3Ease of manufacture
If the thermistor and carrier are integral injection-molded, then the manufacturing process is simplified, but the cost increases and heat transfer is hindered by the plastic casing
Solution Approach 1:
The patent divides the sensor structure into separate components: the thermistor, the thermowell, and the carrier housing. This segmentation allows the thermistor to be mounted on the thermowell which provides direct thermal coupling to the medium, while the carrier housing provides structural support and protection. This resolves the contradiction by eliminating the plastic casing barrier to heat transfer while maintaining manufacturing feasibility through modular assembly.
4Ease of operation
If the thermistor is connected via a flexible circuit board bypassing the pressure-sensing component, then the connection is achieved, but the process is complicated and production costs increase
Solution Approach 1:
The patent combines the electrical connection path with the existing structural components. The thermistor is electrically connected to the circuit board through connections that are integrated into the carrier and housing structure, eliminating the need for separate flexible circuit board bypass paths. This merging of functions reduces assembly complexity and production costs while achieving the required electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances sensor reliability and response time while optimizing assembly processes, reducing costs by using a centrally symmetric structure and separate signal transmission paths, thus improving accuracy and lowering production expenses.
Implementation Method 1
a temperature sensing element provided in the thermowell
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
An integrated temperature and pressure sensor relates to the technical field of sensors. The integrated sensor includes: a connector (1); a metal tube (2) with a cavity (21), the open end of the cavity (21) of the metal tube (2) is connected to the connector (1), and another end of the metal tube (2) is provided with a first channel (22) and a second channel (23); a carrier part (4) with an accommodation cavity (41), the carrier part is provided in the cavity (21), and the bottom of the carrier part (4) is provided with a third channel (43) communicating with the second channel (23); a thermowell (3), one end of the thermowell (3) is located in the first channel (22), and another end of the thermowell (3) extends out of the first channel (22); a temperature sensing element (5) arranged in the thermowell (3); a pressure sensing element (6) arranged in the accommodation cavity (41), and the pressure sensing element (6) is located on the third channel (43); and a circuit board (7).