Temperature-Responsive Tape for Electronic Device Disassembly
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Solution Overview
Problem
Existing double-sided tapes in portable communication devices provide strong bonding forces that can damage components during reassembly and disassembly, leading to weakened adhesion and reliability issues when attempting to reuse them.
Innovation Solution
A temperature-responsive tape member with a substrate and two bonding layers, where one layer maintains strong bonding at low or high temperatures and the other layer reduces bonding force between 50° C. to 70° C., allowing for easy disassembly and reassembly without damaging components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If double-sided tape with strong bonding force is used to fix components, then the fixing force between components is improved, but the components cannot be easily disassembled and reassembled without damage
Solution Approach 1:
The bonding force of the tape member is made dynamic by utilizing temperature-responsive materials. The adhesive layer changes its bonding characteristics based on temperature: maintaining strong bonding at low temperatures for secure component fixation, and reducing bonding force at elevated temperatures (50-70°C) to enable easy disassembly and reassembly without component damage
Solution Approach 2:
The bonding force parameter of the adhesive layer is changed through temperature variation. The adhesive material is selected or formulated to exhibit temperature-dependent bonding properties, allowing the bonding force to be adjusted from strong (at low temperature) to weak (at high temperature), thereby resolving the contradiction between strong fixation and easy repair
2Reliability
If double-sided tape with strong bonding force is used to fix components, then the reliability of the product is improved, but the bonding force becomes weak after damage and components cannot be reused
Solution Approach 1:
The adhesive layer provides dynamic bonding behavior that maintains strong adhesion during normal operation (low temperature) ensuring product reliability, but allows controlled debonding at elevated temperatures for component reuse. This dynamic characteristic enables the same bonding interface to serve both reliability and reusability functions
Solution Approach 2:
The temperature-responsive adhesive allows for controlled discarding of the bonding function at elevated temperatures, enabling component separation and recovery. After repair, the same components can be reassembled using the same or new tape members, as the adhesive does not permanently damage the components during the disassembly process
3Ease of operation
If the bonding force of double-sided tape is lowered to enable easy disassembly, then the ease of operation is improved, but the fixing force between components deteriorates
Solution Approach 1:
The bonding force parameter is made variable through temperature changes. At low temperatures, the adhesive maintains strong bonding force for secure component fixation. When heated to 50-70°C, the adhesive's bonding force decreases, enabling easy disassembly. This parameter change resolves the contradiction by making the bonding strength conditional rather than fixed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the fixing force between components at various temperatures while enabling easy disassembly and reassembly, reducing repair costs by using a low-priced heat chamber to lower the bonding force, thus improving the reliability and longevity of electronic devices.
Implementation Method 1
one of the first bonding layer and the second bonding layer includes a material having a bonding force in a selected range in a selected temperature range
Data Source
AI summary
Disclosed are various embodiments related to a bonding member that bonds components of an electronic device. An electronic device may include a tape member that include: a first bonding layer and a second bonding layer. One of the first bonding layer and the second bonding layer comprises a material having a bonding force in a selected range in a predetermined temperature range.