Temperature-Responsive Heat Dissipation Structure With Vent Cover
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Solution Overview
Problem
Electronic devices, particularly slim laptops, face challenges in effectively dissipating heat from components due to limited space, leading to overheating issues that can cause performance degradation or battery explosions.
Innovation Solution
A heat dissipation structure featuring a housing with an opening, a cover, and a link structure connected to an actuator that responds to temperature changes to open or close air inlets/outlets, utilizing elastic structures and springs to manage heat dissipation efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the electronic device is made slim, then the aesthetic appearance and portability are improved, but the heat dissipation performance deteriorates due to limited space
Solution Approach 1:
The patent implements a dynamic heat dissipation system where the cover can automatically open or close based on internal temperature detection. The actuator responds to temperature changes, causing the link structure to move the cover between open and closed states, thereby dynamically adjusting heat dissipation capacity to match thermal conditions while preserving the slim device profile
Solution Approach 2:
The patent embeds the heat dissipation mechanism within the existing device structure. The link structure is positioned inside the housing and connected to the cover, with the actuator integrated into the same space. This nesting approach allows the heat dissipation system to function without adding external bulk, maintaining the slim form factor while providing effective thermal management
2Temperature
If a traditional heat dissipation structure is implemented, then the heat dissipation performance is improved, but the device complexity and space requirement increase
Solution Approach 1:
The cover serves multiple functions: it acts as both a protective closure for the opening and a heat dissipation control element. The link structure serves dual purposes as both a mechanical linkage for cover actuation and a structural component integrated into the housing. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby reducing overall device complexity
Solution Approach 2:
The system employs a self-regulating heat dissipation mechanism where the actuator automatically detects internal temperature and triggers the cover to open or close accordingly. This self-service approach eliminates the need for external control systems, complex sensors, or manual intervention, simplifying the overall device architecture while maintaining effective thermal management
3Shape
If the cover is kept closed for aesthetic appearance, then the aesthetic appearance is improved, but the heat dissipation performance deteriorates
Solution Approach 1:
The system dynamically adjusts the cover position based on thermal conditions. When internal temperature is low, the cover remains closed to maintain aesthetic appearance. When internal temperature exceeds thresholds, the actuator automatically opens the cover to prioritize heat dissipation. This dynamic behavior allows the device to seamlessly transition between aesthetic and functional states
Solution Approach 2:
The actuator continuously monitors internal temperature and uses this feedback to control cover position. The system receives feedback from temperature detection and adjusts the cover state accordingly, creating a closed-loop control system that balances aesthetic appearance and heat dissipation performance based on real-time thermal conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure improves heat dissipation performance and aesthetic appearance by dynamically adjusting airflow based on internal temperature, effectively managing heat and preventing overheating.
Implementation Method 1
an actuator configured to output power based on a temperature detected inside the housing
Implementation Method 2
a second link configured to transmit the power in a second direction perpendicular to the first direction in response to a movement of the first link and including an elastic structure including a first spring and a second spring having different elastic forces
Data Source
AI summary
According to an embodiment, an electronic device comprises: a housing comprising an opening; a cover for opening and closing the opening; and a link structure located inside the housing and connected to the cover, wherein the link structure may comprise: an actuator configured to output power based on the temperature sensed inside the housing; a first link configured to move in a first direction by means of the power; a second link having a resilient structure that, in response to the movement of the first link, is configured to transmit the power in a second direction perpendicular to the first direction and comprises a first spring and a second spring having different elastic forces; and a third link connected to the second link and the cover and configured to convert the cover from a closed state to an open state by transmitting the power in the first direction and a third direction perpendicular to the second direction.