Temperature Sensor Ring for Thermal Conductivity Control

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Solution Overview

Problem

Typical temperature sensors have limited thermal conductivity due to the materials used in their encapsulation or thermal conductive paste, which restricts their response time and measurement accuracy.

Innovation Solution

A temperature sensor design that includes a sensor element, a sheath, and a ring with adjustable thermal conductivity, allowing the overall thermal conductivity to be tailored for specific applications, enhancing response speed and mechanical protection of supply leads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a potting material or thermal conductive paste is used for the sheath, then electrical insulation is achieved, but thermal conductivity is limited

Engineering Contradiction:
Improveelectrical insulationVSAvoidthermal conductivity
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent applies composite materials by combining the sheath (made of electrically insulating potting material or thermal conductive paste) with a ring (made of material having different thermal conductivity). This composite structure allows the sheath to provide electrical insulation while the ring compensates for thermal conductivity limitations, achieving both electrical insulation and improved thermal transfer to the sensor element.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the sheath material has limited thermal conductivity, then electrical insulation is maintained, but response time increases

Engineering Contradiction:
Improveelectrical insulationVSAvoidresponse time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The ring acts as an intermediary component between the sheath and the sensor element. It is positioned in thermal contact with both the sheath and the sensor element, facilitating heat transfer. The ring's material is selected to have different thermal conductivity than the sheath, optimizing the thermal pathway and reducing response time while the sheath maintains electrical insulation.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Speed

If the ring has higher thermal conductivity than the sheath, then response speed increases, but device complexity increases

Engineering Contradiction:
Improveresponse speedVSAvoidstructural complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent segments the thermal management function into two distinct components: the sheath (providing electrical insulation) and the ring (providing enhanced thermal conductivity). This segmentation allows each component to be optimized independently for its specific function, achieving improved response speed through the high thermal conductivity ring while keeping the overall structure relatively simple and modular.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adjustable thermal conductivity of the ring allows for optimized response speed matching with control units, improving measurement accuracy and electrical breakdown resistance while reducing mechanical damage to supply leads.

Implementation Method 1

The material of the sheath can be selected such that it is not electrically conductive... The thermal conductivity of the sheath material affects the response speed of the temperature sensor

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The ring may have a thermal conductivity that differs from the thermal conductivity of the sheath. This allows the thermal conductivity of the elements surrounding the sensor element to be adapted to the requirements of a system environment

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20210033473A1Temperature Sensor
Publication Date: 2021.02.04 TDK ELECTRONICS AG
  • US20210033473A1 patent drawing

AI summary

A temperature sensor is disclosed. In an embodiment a temperatures sensor includes a sensor element, a sheath surrounding the sensor element and a ring surrounding the sensor element, wherein the ring is covered by the sheath.