Temperature-Variable Standoff for Circuit Board Thermal Management
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Solution Overview
Problem
Existing electronics assemblies face inefficiencies and high costs due to the need for expensive, space-consuming, and weighty temperature-controlled systems to manage temperature-sensitive electrical devices, especially in extreme temperature conditions.
Innovation Solution
A temperature-variable standoff structure with an integrated electrical element that can be electrically controlled to adjust temperature, providing compact, efficient, and lightweight temperature management within the assembly by using a support body and electrical connectors to connect with the circuit board's power supply circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a temperature-controlled system is used to manage temperature-sensitive electrical devices, then the temperature control effectiveness is improved, but the device size, weight, and manufacturing cost increase
Solution Approach 1:
The patent combines the temperature control function with the existing standoff structure by integrating a heating element into the standoff body. This merging eliminates the need for separate temperature control systems, reducing overall assembly weight while maintaining temperature control effectiveness for sensitive electrical devices.
Solution Approach 2:
The standoff structure is designed to serve multiple functions: mechanical support for the circuit board, electrical connection through integrated connectors, and temperature control through embedded heating elements. This multi-functionality eliminates the need for separate dedicated temperature control components, thereby reducing weight.
2Temperature
If a temperature-controlled system is used to manage temperature-sensitive electrical devices, then the temperature control effectiveness is improved, but the assembly space requirement increases
Solution Approach 1:
The temperature control function is merged into the standoff structure itself, eliminating the need for separate temperature control components. This integration ensures that no additional space is consumed by separate heating systems, as the control function is embedded within the existing structural footprint.
Solution Approach 2:
The heating element is nested within the standoff body structure, with the temperature control functionality embedded inside the existing structural components. This nesting approach ensures that the temperature control system occupies no additional assembly space beyond what is already required for the standoff structure itself.
3Temperature
If expensive temperature-controlled systems are used, then the temperature control effectiveness is improved, but the manufacturing cost increases
Solution Approach 1:
By merging the temperature control function with the standoff structure, the patent eliminates the need for separate expensive temperature control systems. The integrated design uses standard heating elements and existing standoff components, significantly reducing manufacturing costs while maintaining effective temperature control.
Solution Approach 2:
The patent employs inexpensive heating elements and standard electronic components within the standoff structure rather than expensive specialized temperature control systems. This approach uses affordable, readily available components to achieve the required temperature control functionality, thereby reducing manufacturing costs.
4Productivity
If a compact temperature-control mechanism is integrated within the assembly, then the assembly efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent integrates the temperature control mechanism directly into the standoff structure, combining multiple functions (support, connection, heating) into a single component. This integration improves assembly efficiency by reducing the number of separate parts to be installed, while the modular design keeps the complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains temperature-sensitive device functionality across various environments, reduces manufacturing costs, and enhances assembly efficiency by integrating a compact temperature-control mechanism directly within the electronics assembly.
Implementation Method 1
a temperature-variable electrical element (210) that selectively varies in temperature based on an electrical input thereto
Implementation Method 2
a support body (212) that supports the temperature-variable electrical element (210) and that is configured to support the circuit board (200) separated at a distance from another component of the electronics assembly
Data Source
Figure 1
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Figure 4~5
AI summary
A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.