Temperature Measurement Wafer Layout for High-Heat Data Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional temperature measurement techniques using temperature measurement wafers with memory fail when exposed to high temperatures, as the memory can break down, preventing the use of stored temperature data and effectively rendering temperature measurement impossible.
Innovation Solution
A temperature measurement unit comprising a measurement substrate with temperature sensors, an information processor, and a cable that allows the information processor to be installed facing a heating area with a cooling area in between, enabling the measurement of temperature on a hot plate without exposing the processor to high temperatures, thus preventing damage and allowing accurate temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature measurement substrate with memory is exposed to high temperature heating area, then the temperature measurement function is improved, but the memory breaks down and measurement data is lost
Solution Approach 1:
The system is divided into two separate functional modules: a measurement substrate that remains in the high-temperature heating area to perform temperature measurement, and an information processor located in the low-temperature cooling area to store and process measurement data. This segmentation allows each component to operate in its optimal temperature environment, resolving the contradiction between measurement function and memory reliability.
Solution Approach 2:
A cable serves as an intermediary connection between the measurement substrate in the heating area and the information processor in the cooling area. This intermediary enables data transmission across the temperature boundary without exposing the information processor to high temperatures, thus maintaining both measurement capability and data reliability.
2Loss of time
If the information processor is installed in the heating area to acquire temperature data directly, then the measurement time is reduced, but the processor is damaged by high temperature
Solution Approach 1:
The cable acts as a thermal and physical intermediary, allowing the information processor to access temperature measurement data without being physically present in the high-temperature heating area. This resolves the contradiction by enabling fast data acquisition while protecting the processor from thermal damage.
Solution Approach 2:
The information processor is extracted from the heating area and placed in the cooling area, separating the data processing function from the high-temperature environment. This extraction maintains measurement efficiency while eliminating the harmful high-temperature effect on the processor.
3Device complexity
If the measurement substrate is kept in the cooling area to protect it from heat, then the device complexity is reduced, but the temperature measurement capability is lost
Solution Approach 1:
The system segments the measurement and processing functions into separate locations. The measurement substrate remains in the heating area to maintain temperature measurement capability, while the information processor is placed in the cooling area. This simple segmentation resolves the contradiction without requiring complex mechanisms.
Solution Approach 2:
The system replaces the need for mechanical movement of the measurement substrate by using a cable-based data transmission system. The measurement substrate stays stationary in the heating area, and data is transmitted electronically through the cable to the information processor, simplifying the overall system while maintaining measurement capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables safe and efficient temperature measurement of substrates heated to high temperatures by keeping the information processor out of the high-temperature environment, ensuring reliable data acquisition and reducing measurement time by half compared to alternative methods.
Implementation Method 1
the cable is configured to be able to follow movement of the measurement substrate when a cooling plate on which the measurement substrate is placed is moved from the cooling area to the heating area
Implementation Method 2
a sensor configured to measure a temperature
Data Source
AI summary
A temperature measurement unit includes a measurement substrate on which a sensor configured to measure a temperature is mounted, an information processor configured to acquire a result of detection by the sensor, and a cable connecting the sensor and the information processor to each other. The information processor is configured to be detachably installed on an installation part facing a heating area provided with a hot plate, with a cooling area interposed therebetween. The cable is configured to be able to follow movement of the measurement substrate when a cooling plate on which the measurement substrate is placed is moved from the cooling area to the heating area and the measurement substrate is placed on the hot plate in a state in which the information processor is installed on the installation part.