Tempering chamber having peltier elements

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Solution Overview

Problem

Existing tempering modules with multiple Peltier elements experience bending and surface flatness changes due to thermal expansion, leading to reduced lifetime and increased failure rates, and inefficient cooling configurations reduce available space.

Innovation Solution

A compact tempering chamber design with Peltier elements, where each element has a common shared hot heatsink and separate cold heatsinks, with air flushing and fans positioned to maintain surface flatness and enhance cooling efficiency, using spacers and resilient attachments to manage thermal expansion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple Peltier elements are used with a common shared heated heatsink and separate cooled heatsinks, then the flatness of contact surfaces is maintained and reliability is improved, but the device complexity increases

Engineering Contradiction:
ImprovePeltier element lifetimeVSAvoidtempering module structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The cooled heatsinks are separated into individual units for each Peltier element, while the heated heatsink remains common and shared. This segmentation allows each Peltier element to maintain independent thermal contact surfaces, preventing bending and flatness changes that would occur with a common cooled heatsink, thereby improving reliability without requiring complete separation of all heatsinks.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heated heatsink is designed as a common shared component for multiple Peltier elements, consolidating the heating function while maintaining separate cooled heatsinks. This merging reduces overall device complexity compared to having completely separate heatsink assemblies for each element, while still preserving the flatness maintenance benefit through the separate cooled sides.

Inventive Principle:
Principle #5Merging (Combining)

2Volume of moving object

If the tempering module uses a compact arrangement with fans positioned on the same side, then space utilization is optimized, but the cooling effectiveness must be maintained

Engineering Contradiction:
Improvetempering chamber spaceVSAvoidcooling effectiveness
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The cooling fins of the separate cooled heatsinks are oriented in different directions (first set in first direction, second set in second direction perpendicular to the first). This dimensional arrangement allows compact positioning of multiple heatsinks on the same side of the tempering chamber while maintaining effective cooling surfaces exposed to air flow from the common fan, optimizing space without sacrificing cooling performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Loss of energy

If thermal insulation layer thickness is increased to reduce heat exchange between heated and cooled heatsinks, then energy efficiency is improved, but the distance between heatsinks increases

Engineering Contradiction:
Improveunwanted heat exchangeVSAvoiddistance between heatsinks
Core Design Contradiction:
Loss of energyVSLength of moving object

Solution Approach 1:

By separating the cooled heatsinks into individual units rather than using a single large common cooled heatsink, the design enables placement of thinner insulation layers between each Peltier element and its dedicated cooled heatsink. The segmented arrangement reduces the total insulation thickness required compared to a single large insulation layer, thereby reducing the overall distance between heated and cooled sides while still preventing unwanted heat exchange.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design maintains surface flatness, extends module lifetime, reduces failure rates, and optimizes space utilization while enhancing cooling effectiveness.

Implementation Method 1

A Peltier element is an electronic component that, when an electric current passes through it, develops different temperatures at the contact surfaces of two conductors (the so-called Peltier effect). Thus, when an electric current passes through the element, the Peltier element behaves like a heat pump

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

both heatsinks are flushed with a liquid medium, usually air

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

a first fan is arranged on an outer side of said wall on which the first heatsink is arranged for pushing air into the first heatsink

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 4

As the electric current passes through the Peltier elements, the heated heatsink starts to lengthen, and the cooled heatsink shortens due to thermal expansion

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP4528182B1Tempering chamber having peltier elements
Publication Date: 2025.11.19 BMT MEDICAL TECH S R O
  • EP4528182B1 patent drawingFigure 1~2
  • EP4528182B1 patent drawingFigure 3A~3B

AI summary

The invention relates to a tempering module comprising at least two Peltier elements (2), wherein each Peltier element (2) has a first side and a second side, and wherein said at least two Peltier elements (2) are oriented with their first side so as to be in thermal contact with a common shared first heatsink (1). Each Peltier element (2) is oriented with its second side so as to be in thermal contact with a separate second heatsink (4). The invention further relates to a tempering chamber comprising said tempering module.