Template Manufacturing Method for High-Precision Step Structures

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Solution Overview

Problem

Existing template manufacturing methods lack precision in forming step-shaped patterns, which is crucial for semiconductor device processing, as they struggle to achieve high precision and productivity simultaneously.

Innovation Solution

A template manufacturing method involving a stacked structure with alternating layers of different materials, where a cover layer and resist layer are used as masks to expose specific layers, allowing for precise etching and formation of step structures with high precision and throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional template manufacturing methods are used, then manufacturing simplicity is maintained, but manufacturing precision deteriorates

Engineering Contradiction:
Improvestep structure precisionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The template is divided into multiple stacked films with different materials (first material and second material) arranged in alternating layers. This segmentation allows each layer to be selectively etched to form precise step structures, resolving the contradiction by enabling high precision through structured division rather than complex manufacturing processes

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The stacked films are prepared in advance with alternating materials before the etching process. This preliminary arrangement of materials in specific patterns allows subsequent etching to automatically produce the desired step structures, achieving high precision without requiring complex real-time manufacturing control

Inventive Principle:
Principle #10Preliminary action

2Productivity

If conventional template manufacturing methods are used, then equipment simplicity is maintained, but productivity deteriorates

Engineering Contradiction:
Improvetemplate manufacturing throughputVSAvoidmanufacturing equipment complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

By segmenting the template into stacked films of alternating materials, the manufacturing process can utilize standard etching equipment to selectively remove materials layer by layer. This approach achieves high productivity through systematic material removal rather than requiring complex specialized equipment

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention changes the material parameters of the template structure by using alternating materials with different etching characteristics. This parameter change enables selective etching processes that can be performed with conventional equipment, improving productivity without increasing equipment complexity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the creation of templates with highly precise step structures, improving productivity and allowing for high-precision pattern transfer in semiconductor devices without requiring complex or expensive manufacturing equipment.

Implementation Method 1

solidifying the resin liquid film while the first surface of the first template is in contact with the resin liquid film to form the resin layer defining a resin layer surface shape that corresponds to a shape of the step structure

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS11762286B2Template manufacturing method and template base member
Publication Date: 2023.09.19 KIOXIA CORP
  • US11762286B2 patent drawing
  • US11762286B2 patent drawing
  • US11762286B2 patent drawing

AI summary

A template manufacturing method includes preparing a structure including a first substrate and a stacked body that is provided on the first substrate, the stacked body including a first lower layer including a first material, a first upper layer provided on the first lower layer including a second material different from the first material, and a first cover layer provided on a first cover region of the first upper layer and including a third material different from the second material. The method further includes forming a first resist layer on a portion of the first cover layer and on a first portion of the first upper layer, and exposing a second portion of the upper layer. The method yet further includes removing the second portion of the first upper layer using the first cover layer and the first resist layer as a mask.