Template Mask Patterning for 3D NAND Multi-Gradation Etching

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Solution Overview

Problem

Current pattern forming methods for semiconductor devices, particularly in three-dimensional NAND flash memory manufacturing, face challenges in achieving high manufacturing efficiency and accuracy due to complex multi-gradation patterns required for stacked conductive layers.

Innovation Solution

A method involving the formation of a template with inclined and recessed portions, where a second layer with a specific etching pattern is used as a mask to transfer a pattern with protrusion portions of varying heights onto a first layer, enhancing the precision and efficiency of pattern formation through multiple etching processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional pattern forming methods are used for three-dimensional NAND flash memory, then manufacturing process is simpler, but manufacturing efficiency and accuracy deteriorate due to inability to achieve high-precision multi-gradation patterns

Engineering Contradiction:
Improvepattern formation accuracyVSAvoidtemplate structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The template is divided into multiple layers (first layer and second layer) with distinct functions. The first layer provides the base structure while the second layer contains the etching pattern that transfers the multi-gradation pattern. This segmentation allows each layer to be optimized independently, achieving high manufacturing precision without requiring the entire template to be overly complex.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention introduces vertical dimensionality by creating protrusion portions with varying heights in the second layer. This multi-gradation structure in the stacking direction enables the formation of contact holes with different depths, achieving high-precision pattern formation for multiple conductive layers without increasing horizontal complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If multi-gradation patterns are formed using conventional methods, then contact area increases, but manufacturing efficiency deteriorates due to complex processing steps

Engineering Contradiction:
Improvecontact reliabilityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The etching pattern is pre-formed on the second layer before the actual contact hole etching process. This preliminary action allows the multi-gradation pattern to be transferred in a single etching step, significantly improving manufacturing efficiency while ensuring reliable contact formation. The pattern transfer step prepares the structure in advance, eliminating the need for multiple sequential etching operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The second layer with the etching pattern serves as an intermediary between the template design and the final contact structure. This intermediary layer enables the transfer of the multi-gradation pattern to the underlying layers, allowing efficient formation of varied contact depths without requiring complex direct patterning methods.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If template with inclined portions is used, then pattern transfer precision improves, but template manufacturing complexity increases

Engineering Contradiction:
Improvepattern transfer precisionVSAvoidtemplate manufacturing ease
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The inclined portions are formed only in the second layer, separating the complexity of precision patterning from the first layer. This segmentation allows the second layer to be manufactured with higher precision using specialized techniques, while the first layer can be manufactured more simply. The divided structure makes the overall template manufacturing more manageable despite the precision requirements.

Inventive Principle:
Principle #1Segmentation

4Manufacturing precision

If multiple etching processes are performed, then manufacturing accuracy improves, but processing time increases

Engineering Contradiction:
Improvepattern formation accuracyVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The invention merges the pattern transfer and contact hole formation steps into a single etching process. The etching pattern on the second layer is used as a mask that simultaneously defines the contact hole positions and depths. This merging eliminates the need for separate patterning and etching steps, reducing processing time while maintaining high manufacturing precision through the multi-gradation structure.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the formation efficiency and accuracy of multi-gradation patterns, enabling the creation of reliable semiconductor devices with increased contact area and improved reliability by precisely controlling the etching processes and template design.

Implementation Method 1

performing, with the second layer as a mask, a first etching process to remove a part of the first layer

Methodology Applied
Scientific EffectEtching:

Data Source

PatentUS20230420291A1Pattern forming method, template manufacturing method, and semiconductor device manufacturing method
Publication Date: 2023.12.28 KIOXIA CORP
  • US20230420291A1 patent drawing
  • US20230420291A1 patent drawing
  • US20230420291A1 patent drawing

AI summary

A pattern forming method includes: forming a second layer over a first layer; forming a first pattern along a surface of the second layer opposite to the first layer, the first pattern including an inclined portion with a recessed portion; and forming a second pattern on the first layer by performing, with the second layer as a mask, a first etching process to remove a part of the first layer.