Template Pattern Layout for Uniform Residual Film Thickness
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Solution Overview
Problem
The existing imprint process for manufacturing semiconductor devices faces challenges in maintaining uniform residual film thickness of transferred patterns, leading to variations due to differences in density on the transfer surface.
Innovation Solution
A design pattern generation method that includes generating an actual pattern with protruding features, calculating the volume of these features per unit area, and adding a dummy pattern to regions where the volume difference exceeds a specified value, thereby correcting density variations and maintaining uniform film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dummy pattern is used to correct density difference on transfer surface, then density uniformity is improved, but residual film thickness variation increases
Solution Approach 1:
The patent applies local quality by creating three-dimensional patterns with varying heights (first, second, and third patterns at different elevation levels) to locally compensate for density differences. Instead of using a uniform dummy pattern, the invention introduces height variations that correspond to the local density requirements, allowing precise control over both density uniformity and residual film thickness distribution across the transfer surface.
Solution Approach 2:
The patent transitions from two-dimensional pattern correction to three-dimensional pattern correction by introducing height as an additional dimension. The patterns are formed at different heights from the template surface, creating a stepped three-dimensional structure. This dimensional change enables simultaneous control of both areal density and volumetric displacement, resolving the contradiction between density uniformity and residual film thickness uniformity.
2Manufacturing precision
If the volume of patterns is increased to correct density, then density uniformity is improved, but residual film thickness control deteriorates
Solution Approach 1:
The patent segments the correction pattern into multiple discrete height levels (first pattern at lowest height, second pattern at intermediate height, third pattern at highest height). This segmentation allows the total volume to be distributed across different elevation tiers, enabling independent control of density correction (through total volume) and residual film thickness (through height distribution). Each segmented layer contributes differently to the overall correction effect.
Solution Approach 2:
The patent employs parameter changes by varying the height parameter of patterns across different regions. Instead of uniformly increasing pattern volume, the invention changes the height parameter selectively to create a multi-level structure. This parameter variation allows optimization of both density uniformity (through controlled volume distribution) and residual film thickness (through strategic height placement), resolving the contradiction between these two precision requirements.
Data Source
AI summary
A design pattern generation method of an embodiment is a method for generating a design pattern of a template. The design pattern generation method includes: generating an actual pattern including a first pattern protruding from a contact surface of the template with a material layer and extending in a predetermined direction along the contact surface, and a second pattern further protruding from an upper surface of the first pattern; calculating a volume of the first pattern and the second pattern per unit area on the contact surface; and adding, when a difference in the volume of the first pattern and the second pattern per unit area between regions on the contact surface exceeds a specified value, a third pattern to a region where the volume of the first pattern and the second pattern per unit area is small.