Template Pattern Splitting for Sub-100 nm Line Widths
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Solution Overview
Problem
Current methods for manufacturing templates, such as electron beam direct writing and laser direct writing, face challenges in achieving high fineness while maintaining production efficiency, as they struggle to further reduce line width and enhance pattern density effectively.
Innovation Solution
A method involving the formation of photoresist patterns on a base, where a material layer is used as an etch mask to create sub-patterns, allowing for repeated patterning to achieve finer line widths and increased pattern density, ultimately resulting in a template with line widths less than 100 nm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods (electron beam direct writing, laser direct writing) are used for template manufacturing, then production efficiency is maintained, but line width reduction and pattern density enhancement are limited
Solution Approach 1:
The patent applies segmentation by dividing the pattern formation process into multiple stages: first forming initial photoresist patterns, then using material layers as etch masks to create sub-patterns, and repeating the process to achieve progressively finer line widths. This multi-stage segmentation enables line width reduction below 100 nm while maintaining production efficiency through parallel processing capabilities.
2Manufacturing precision
If material layer is used as etch mask to create sub-patterns through repeated patterning, then line width is reduced and pattern density is increased, but process complexity increases
Solution Approach 1:
The patent employs dimensionality change by utilizing the vertical dimension (thickness direction) to solve planar pattern density issues. Material layers are deposited and patterned in the vertical dimension, then used as etch masks to define sub-patterns in the horizontal plane. This approach increases pattern density without proportionally increasing process complexity, as the vertical layering enables efficient use of each patterning step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the fineness of the template by reducing line width and increasing pattern density, overcoming the limitations of existing methods by producing templates with improved resolution and efficiency.
Implementation Method 1
a photoresist layer is formed on the base; the photoresist layer is exposed through a mask, so that a photoresist pattern is formed on the base
Implementation Method 2
a material layer is formed on the photoresist pattern
Implementation Method 3
a material layer is formed on the photoresist pattern
Implementation Method 4
the photoresist pattern is etched by using the material layer as an etch mask, so that the photoresist pattern is formed into a plurality of photoresist sub-patterns
Data Source
Figure 1A(a)~1B(b)
Figure 1C~1D(b)
Figure 1E(a)~1F(b)
AI summary
A template preparation method, comprising: providing a substrate (100); forming a photoresist pattern (200) on the substrate (100); and patterning the substrate (100) by using the photoresist pattern (200) as a mask. In addition, said forming a photoresist pattern (200) comprising: forming, on the substrate (100), a plurality of first patterns (210) arranged at intervals; forming a first material layer (300) on the plurality of first patterns (210); patterning at least one first pattern (210) by using the first material layer (300) as a mask, so as to enable the first pattern (210) to form at least one first sub-pattern (211); and removing the first material layer (300), the first material layer (300) at least covering, in a direction perpendicular to a plane where the substrate (100) is located, one side of the at least one first pattern (210). The method above can improve the fineness of a template.