Temporary Adhesive Cleaning Composition for Silicone Residue Removal
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Solution Overview
Problem
The existing cleaning solutions for temporary adhesive layers on semiconductor substrates have inadequate detergency, failing to effectively remove the remaining adhesive from the front surface after the support separation process.
Innovation Solution
A cleaning solution comprising tetrabutylammonium fluoride, dimethyl sulfoxide, and a liquid compound with a solubility parameter of 8.0 to 10.0 and a heteroatom, such as ketone or ester groups, is used to efficiently remove silicone-based temporary adhesives from the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning solutions containing quaternary ammonium salt, water, and organic solvent are used, then the substrate can be cleaned, but the detergency for temporary adhesive layer is insufficient
Solution Approach 1:
The patent changes the chemical parameters of the cleaning solution by replacing conventional quaternary ammonium salt with tetrabutylammonium fluoride, and adjusting the organic solvent composition to include dimethyl sulfoxide and specific liquid compounds with defined solubility parameters (8.0-10.0), thereby improving detergency for silicone-based temporary adhesives
Solution Approach 2:
The cleaning solution employs a composite formulation combining tetrabutylammonium fluoride (1-15 mass%), dimethyl sulfoxide (5-30 mass%), and liquid compounds with specific solubility parameters (8.0-10.0), creating a synergistic mixture that enhances adhesive removal capability while maintaining substrate integrity
2Reliability
If strong cleaning agents are used to remove temporary adhesive, then detergency improves, but substrate damage risk increases
Solution Approach 1:
The patent modifies the chemical aggressiveness parameters by selecting tetrabutylammonium fluoride and dimethyl sulfoxide, which provide effective adhesive dissolution through solvation and complexation mechanisms while maintaining milder interaction with the silicon substrate, thus preventing damage
Solution Approach 2:
The cleaning solution acts as an intermediary medium that selectively interacts with the temporary adhesive layer through specific chemical mechanisms (fluoride complexation with silicon, sulfoxide solvation), enabling adhesive removal without direct harsh contact between the substrate and aggressive cleaning agents
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent detergency for the temporary adhesive layer, ensuring complete removal without damaging the substrate, as demonstrated by the successful removal of silicone-based adhesives in various examples.
Implementation Method 1
a cleaning solution comprising tetrabutylammonium fluoride, dimethyl sulfoxide, and a liquid compound having a solubility parameter of 8.0 to 10.0 and having a heteroatom
Implementation Method 2
tetrabutylammonium fluoride
Implementation Method 3
dimethyl sulfoxide
Implementation Method 4
a liquid compound having a solubility parameter of 8.0 to 10.0 and having a heteroatom
Data Source
AI summary
A cleaning solution for temporary adhesive for substrates contains: tetrabutylammonium fluoride; dimethyl sulfoxide; and a liquid compound having a solubility parameter of 8.0 or more and 10.0 or less and having a heteroatom. The tetrabutylammonium fluoride is preferably contained at a content of 1 mass % or more and 15 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound. The dimethyl sulfoxide is preferably contained at a content of 5 mass % or more and 30 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound.