Temporary Adhesive Composition for Heat- and Solvent-Stable Wafer Bonding
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Solution Overview
Problem
Existing temporary adhesives in semiconductor processing are not resistant to high temperatures and solvents, leading to damage during procedures like physical vapor deposition and solvent-based processes, and struggle to maintain stable bonding while being easily convertible to a debonding state, limiting their application.
Innovation Solution
A temporary adhesive comprising a polar resin (5-50 wt%) dissolved in a first solvent (30-90 wt%) with a second solvent (5-60 wt%) to improve leveling properties, along with a light blocking material (0.1-20 wt%) to enhance laser debonding resistance, ensuring stability and easy conversion between bonding and debonding states.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional temporary adhesives are used for bonding thin semiconductor wafers to support substrates, then bonding is achieved, but the adhesives are damaged by high temperatures and solvents during processing procedures
Solution Approach 1:
The patent uses a composite adhesive system consisting of multiple resin components (polymerizable resin, oligomer, and additive resin) combined with specific solvent mixtures. This composite formulation provides resistance to both high temperatures and solvents while maintaining bonding stability, directly resolving the contradiction between reliable bonding and resistance to environmental damage.
Solution Approach 2:
The patent modifies the chemical composition parameters of the adhesive by specifying precise ratios of different resins and solvents, and by defining the adhesive layer thickness (1-10 μm). These parameter changes enable the adhesive to withstand processing conditions that would damage conventional adhesives, while still allowing controlled debonding when needed.
2Reliability
If the adhesive maintains strong bonding during processing, then stable attachment is achieved, but it becomes difficult to convert to a debonding state
Solution Approach 1:
The patent creates a dynamic adhesive system where the bonding strength can be modulated. The adhesive maintains strong bonding during processing through its composite formulation, but can be converted to a debonding state by controlling processing parameters such as solvent exposure time and temperature, allowing easy separation when needed.
Solution Approach 2:
The patent incorporates specific additives and resin combinations that prepare the adhesive for controlled debonding. The preliminary formulation includes components that maintain bonding during processing but can be activated to facilitate easy separation, enabling the transition from bonding to debonding state on demand.
3Manufacturing precision
If the adhesive layer is made thin to prevent interference with substrate processing, then processing quality is improved, but bonding strength is reduced
Solution Approach 1:
The patent optimizes the adhesive layer thickness parameter to 1-10 μm, which is thin enough to prevent interference with substrate processing (maintaining manufacturing precision) while the composite formulation provides sufficient bonding strength within this reduced thickness, resolving the contradiction between thinness and strength.
Solution Approach 2:
The patent uses a composite adhesive formulation with multiple resin components and solvents that provides high bonding strength per unit thickness. This allows the adhesive layer to be made thin (1-10 μm) without sacrificing bonding strength, as the composite materials provide enhanced adhesive properties that compensate for the reduced thickness.
4Ease of manufacture
If conventional adhesives are used, then application is simple, but they lack resistance to chemical and thermal stress during semiconductor processing
Solution Approach 1:
The patent employs a composite adhesive system with polymerizable resin, oligomer, and additive resin in specific ratios, combined with solvent mixtures. This composite formulation provides resistance to chemical and thermal stress during semiconductor processing while maintaining ease of application through standard coating methods, resolving the contradiction between simplicity and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive maintains stable bonding under high temperatures and solvent exposure, facilitates easy debonding, and prevents laser-induced damage, improving semiconductor wafer processing yields by ensuring excellent bonding capacity and resistance to chemical and thermal stress.
Implementation Method 1
a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin
Implementation Method 2
a temporary adhesive assembly, wherein the temporary adhesive assembly includes a target substrate which is a substrate to be processed, a carrier substrate, and an adhesive glue layer, and the target substrate is adhered to the carrier substrate by the adhesive glue layer
Data Source
AI summary
A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.