Temporary Bonding Adhesive Composition for Laser Peeling
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Solution Overview
Problem
Existing adhesives for temporary bonding in wafer processing are prone to decomposition and heat generation upon low power laser irradiation, leading to potential damage of the support member and substrate, and do not meet the requirements for durability, peeling efficiency, and heat resistance in various processing steps.
Innovation Solution
A composition for temporary bonding comprising a polymerizable component with an aromatic ring bonded to a heteroatom, a photo radical polymerization initiator, and an ultraviolet absorber with a polymerizable functional group, optimized to have an equivalent amount of aromatic rings within a specific range, enabling effective peeling with low power laser irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesives are used for temporary bonding, then bonding durability is achieved, but laser peeling requires high power causing substrate damage
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive by incorporating specific aromatic ring-containing compounds (such as phenolic compounds, resorcinol derivatives) in controlled amounts (0.1-10 wt%). This compositional parameter change enables the adhesive to be decomposed by low power UV lasers (5-500 mW) while maintaining bonding durability during wafer processing, thus resolving the contradiction between strong bonding and easy low-power peeling
Solution Approach 2:
The patent creates a composite adhesive system combining conventional adhesive base materials with specific aromatic ring-containing compounds. This composite formulation achieves dual functionality: the base material provides bonding durability while the aromatic components provide selective laser absorption for easy peeling, thereby resolving the contradiction between strong adhesion and laser-peelability
2Ease of operation
If high power laser is used for peeling, then adhesive decomposition is achieved, but support member and substrate are damaged
Solution Approach 1:
The patent replaces the mechanical/thermal peeling process (high power laser heating) with a photochemical process. The aromatic ring-containing compounds in the adhesive absorb UV laser energy and undergo rapid photochemical decomposition, enabling peeling through chemical bond breaking rather than thermal heating, thus achieving easy peeling without heat damage to support members or substrates
Solution Approach 2:
The patent converts the potential harmful effect of laser energy into a beneficial peeling mechanism. By incorporating aromatic compounds that selectively absorb UV laser energy, the previously harmful high-power laser heating is replaced with a controlled photochemical decomposition process that efficiently breaks adhesive bonds without generating damaging heat, transforming laser energy from a harmful factor into a useful peeling tool
3Adaptability or versatility
If organic resin tape is used for temporary bonding, then flexibility is achieved, but heat resistance and strength are insufficient
Solution Approach 1:
The patent develops a composite adhesive composition that combines the flexibility of organic resin-based adhesives with the heat resistance of aromatic ring-containing compounds. The base adhesive provides flexibility and ease of application, while the aromatic additives (phenolic compounds, resorcinol derivatives) contribute thermal stability and structural strength, achieving both flexibility and heat resistance simultaneously
4Strength
If adhesive with strong bonding is used, then substrate support is improved, but laser peeling becomes difficult
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by adding specific aromatic ring-containing compounds in optimized amounts (0.1-10 wt%). This compositional modification creates a dual-character adhesive that forms strong bonds during processing but contains built-in photochemical weak links that enable easy decomposition by UV laser, thus achieving both strong bonding and easy peeling
Solution Approach 2:
The patent segments the adhesive's functionality into two distinct components: the base adhesive material that provides bonding strength and support, and the aromatic ring-containing compounds that provide laser-responsive peeling capability. This functional segmentation allows the adhesive to exhibit strong bonding under normal conditions while enabling easy peeling when exposed to UV laser, resolving the contradiction between bond strength and peeling ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves efficient peeling with low power laser irradiation, maintaining substrate quality and preventing support member damage, while ensuring durability and heat resistance throughout the processing steps.
Implementation Method 1
a photo radical polymerization initiator; and an ultraviolet absorber having a polymerizable functional group
Implementation Method 2
an ultraviolet absorber having a polymerizable functional group
Implementation Method 3
a polymerizable component including a (meth)acrylate containing an aromatic ring bonded to a heteroatom
Data Source
AI summary
The present invention provides a composition for temporary bonding including: (A) a polymerizable component including a (meth)acrylate containing an aromatic ring bonded to a heteroatom; (B) a photo radical polymerization initiator; and (C) an ultraviolet absorber having a polymerizable functional group, in which an equivalent amount of the aromatic ring bonded to the heteroatom in 1 g of the composition for temporary bonding is 0.50 mmol or more and 3 mmol or less.