Temporary Bonding Composition for Flat, Popcorn-Resistant Wafers
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Solution Overview
Problem
Conventional temporary bonding adhesives in semiconductor processes lead to wafer warpage due to stress-induced grain slip and moisture-related popcorn issues, particularly affecting dielectric layers like polyimide.
Innovation Solution
A temporary bonding agent composition comprising specific amounts of a main resin and hydrocarbon-based polymer resins, including functional groups for polyurethane linkage formation, with a balanced ratio to achieve high rigidity, heat resistance, and solubility in basic solutions, ensuring effective gap-filling and easy removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional temporary bonding adhesive is used, then bonding function is achieved, but wafer warpage and grain slip occur due to stress generation
Solution Approach 1:
The patent modifies the chemical composition parameters of the bonding adhesive by incorporating specific ratios of polyurethane resin (5-20 parts), epoxy resin (80-95 parts), and silane-modified polyethylene resin (5-20 parts). This parameter optimization enables the adhesive to maintain bonding reliability while reducing stress-induced wafer warpage and grain slip through improved flexibility and adhesion characteristics.
Solution Approach 2:
The patent creates a composite bonding adhesive system by combining multiple resin types (polyurethane, epoxy, and silane-modified polyethylene) with complementary properties. The polyurethane provides flexibility and stress relief, the epoxy ensures strong adhesion, and the silane-modified polyethylene enhances durability. This composite approach resolves the contradiction by achieving both reliable bonding and maintained wafer flatness through synergistic material properties.
2Reliability
If conventional temporary bonding adhesive is used, then bonding is achieved, but dielectric layer absorbs moisture and generates gas causing popcorn
Solution Approach 1:
The patent optimizes the chemical composition parameters by incorporating hydrophobic resin components (polyurethane and silane-modified polyethylene) in specific ratios (5-20 parts each) to the epoxy matrix. These compositional changes create a moisture-resistant bonding layer that prevents water ingress to the dielectric layer, thereby eliminating popcorn defects while maintaining bonding reliability.
Solution Approach 2:
The patent addresses the moisture sensitivity issue by selecting resin components with inherent hydrophobic properties. The polyurethane and silane-modified polyethylene resins act as protective barriers that convert the potential harm of moisture exposure into a benefit by actively repelling water molecules, preventing both moisture absorption and gas generation in the dielectric layer while preserving bonding functionality.
3Strength
If bonding adhesive with high rigidity is used, then structural stability is improved, but stress concentration increases causing grain slip
Solution Approach 1:
The patent carefully balances the rigidity parameter by selecting specific resin ratios: epoxy resin (80-95 parts) for structural strength, polyurethane resin (5-20 parts) for stress distribution, and silane-modified polyethylene resin (5-20 parts) for flexibility. This parameter optimization creates a bonding layer with adequate rigidity for structural stability while the flexible components distribute stress uniformly, preventing stress concentration and grain slip.
Solution Approach 2:
The patent employs a composite material system where rigid epoxy resin provides structural stability and flexible polyurethane and silane-modified polyethylene resins provide stress distribution. The synergistic combination creates a bonding adhesive with balanced mechanical properties that achieves both structural stability and stress mitigation, preventing grain slip through uniform stress distribution across the bonding interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition forms a rigid temporary bonding layer that prevents grain slip and popcorn, maintains film flatness, and allows efficient removal post-process, enhancing semiconductor manufacturing reliability.
Implementation Method 1
At least one of the hydrocarbon-based polymer resins has a functional group able to react with the main resin to form a polyurethane linkage
Implementation Method 2
the temporary bonding agent composition has a heat resistance temperature in a range from 350° C. to 405° C.
Implementation Method 3
the temporary bonding agent composition can be dissolved in a basic solution, and the basic solution includes at least one of tetramethylammonium hydroxide, tetraethylammonium hydroxide and ethanolamine
Data Source
AI summary
A temporary bonding agent composition and a temporary bonding agent solution are provided. The temporary bonding agent composition includes the main resin and the hydrocarbon-based polymer resins. The main resin includes at least one resin selected from a group consisting of an epoxy resin, an alkyd resin, a phenol formaldehyde resin, a polyurethane resin and a polyester polyol resin. At least one of the hydrocarbon-based polymer resins has a functional group able to react with the main resin to form a polyurethane linkage. Based on an amount of the temporary bonding agent composition as 100 wt %, the main resin is 20 wt % to 35 wt %, and the at least one of the hydrocarbon-based polymer resin is 15 wt % to 30 wt %. A temporary bonding layer formed from the temporary bonding agent composition can have great rigidity.