Temporary Carrier Structure for Thin Substrate Handling
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Solution Overview
Problem
The semiconductor industry faces challenges in handling and processing thin substrates due to their lack of mechanical strength and rigidity, which complicates the manufacturing and packaging of integrated circuit devices as they are scaled down for increased speed and density.
Innovation Solution
A temporary carrier structure with recesses and a dissolvable material is used to secure and support thin substrates, providing mechanical strength during processing, and a release agent is employed to dissolve the material for substrate release, allowing for efficient handling and processing of thin substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin substrates are used to reduce device size and increase packing density, then the overall size of consumer products is reduced, but the mechanical strength and rigidity of substrates deteriorate, making handling and processing problematic
Solution Approach 1:
The substrate handling system is segmented into multiple functional layers: a thin substrate layer for device integration, a dissolvable support layer for mechanical strength during processing, and a carrier structure for handling. This segmentation allows each layer to optimize its specific function while working together as a composite system.
Solution Approach 2:
The patent employs composite material structures combining the thin substrate with a dissolvable support material and carrier. This composite approach provides the necessary mechanical strength during manufacturing while maintaining the thin profile required for high-density packaging, and enables clean separation through selective dissolution of the support material.
2Speed
If thin substrates are used to increase operating speed by reducing component size, then transistor speed increases, but handling and processing become more difficult due to lack of rigidity
Solution Approach 1:
The dissolvable support material acts as an intermediary between the thin substrate and the carrier structure. During handling and processing, this intermediary provides mechanical support and rigidity to the thin substrate, making it easy to manipulate. After processing, the intermediary is selectively removed through dissolution, leaving the thin substrate ready for final assembly.
3Strength
If traditional thick substrates are used to ensure mechanical strength, then handling and processing become easier, but device packing density and overall product size increase
Solution Approach 1:
The dissolvable support material is applied in advance to the thin substrate before processing operations. This preliminary action provides the necessary mechanical strength for handling and processing without requiring the substrate to be permanently thick. After processing, the support material is removed, leaving the thin substrate for high-density packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the mechanical strength and rigidity of thin substrates during processing, enabling effective formation and release of integrated circuit devices, thereby addressing the handling issues associated with thin substrates.
Implementation Method 1
a release agent is employed to dissolve the material for substrate release
Data Source
AI summary
A method of forming a temporary carrier structure is disclosed which includes forming a plurality of recesses in a carrier structure, the recesses extending to a depth that is less than a thickness of the carrier structure, forming a dissolvable material in the recesses and above a first surface of the carrier structure, securing a thin substrate above the first surface of the carrier structure using the dissolvable material to secure the thin substrate in place, performing at least one process operation on a second surface of the carrier structure to expose the dissolvable material in the recesses and contacting the exposed dissolvable material with a release agent so as to dissolve at least a portion of the dissolvable material.