Ultra-Thin Substrate Packaging Using Temporary Carrier Removal
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Solution Overview
Problem
Conventional semiconductor packages and manufacturing methods result in excessive costs, decreased reliability, and large package sizes, which are inadequate for modern semiconductor devices.
Innovation Solution
A semiconductor device and manufacturing method utilizing an ultra-thin substrate structure with a carrier and adhesive layer, where components are mounted and encapsulated, and the carrier and adhesive layer are subsequently removed, enabling reduced size, increased reliability, and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size becomes too large and costs increase
Solution Approach 1:
The substrate is thinned to ultra-thin dimensions before component mounting and encapsulation. This preliminary thinning action enables the final package to achieve reduced size while maintaining manufacturing feasibility through the temporary use of carrier support during the manufacturing process.
Solution Approach 2:
A carrier substrate is introduced as an intermediary support structure during the manufacturing process. The carrier enables handling and processing of the ultra-thin substrate, which would otherwise be too fragile, and is removed after serving its temporary supportive function.
2Reliability
If conventional semiconductor packages are used, then structural support is sufficient, but reliability decreases and costs increase
Solution Approach 1:
The carrier substrate and adhesive layer are extracted and removed after serving their temporary purpose during manufacturing. This extraction eliminates unnecessary structural elements from the final product, reducing complexity while maintaining the reliability benefits of the ultra-thin substrate design.
Solution Approach 2:
The substrate is processed to achieve an ultra-thin film structure that provides sufficient mechanical support for the semiconductor components. This thin-film approach reduces package size and improves reliability by minimizing stress and defect propagation paths.
3Volume of moving object
If ultra-thin substrate is used, then package size reduces and reliability increases, but manufacturing becomes more difficult
Solution Approach 1:
The substrate thinning operation is performed as a preliminary step before component mounting and encapsulation. This sequencing allows the ultra-thin substrate to be manufactured and prepared while still supported by the carrier, making subsequent manufacturing steps feasible despite the reduced substrate thickness.
Solution Approach 2:
The carrier substrate acts as an intermediary that enables the manufacturing of ultra-thin substrates by providing mechanical support during processing. The carrier allows standard manufacturing equipment and processes to be used, and is subsequently removed to reveal the ultra-thin substrate with its size and reliability benefits.
Data Source
AI summary
A semiconductor device and a method of manufacturing a semiconductor device. For example, various aspects of this disclosure provide a semiconductor device having an ultra-thin substrate, and a method of manufacturing a semiconductor device having an ultra-thin substrate. As a non-limiting example, a substrate structure comprising a carrier, an adhesive layer formed on the carrier, and an ultra-thin substrate formed on the adhesive layer may be received and/or formed, components may then be mounted to the ultra-thin substrate and encapsulated, and the carrier and adhesive layer may then be removed.