Temporary Die Support Structure for Thin-Die Warpage Control
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Solution Overview
Problem
Semiconductor dies experience warpage due to thinning, which hinders successful processing in forming semiconductor packages, as the material tends to bend under various forces, preventing successful operations like die bonding and encapsulating.
Innovation Solution
A temporary die support structure is coupled to the semiconductor die, comprising one or more layers of material that can be removably attached using methods like exposure to light, ultrasonic energy, peeling, etching, or grinding, to reduce warpage to less than 200 microns, thereby stabilizing the die during packaging operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor die is thinned to reduce size, then the package size is reduced, but the die experiences increased warpage that hinders processing
Solution Approach 1:
A temporary support structure is applied to the thinned die before packaging operations to prevent warpage during processing. The support structure is placed in advance to counteract the warping forces that occur when the die is handled, bonded, or encapsulated, thereby enabling successful processing of thinned dies without requiring additional thinning steps.
Solution Approach 2:
The temporary support structure acts as an intermediary element between the thinned die and the packaging process. This mediator provides mechanical support to the fragile thinned die, distributing stresses and preventing warpage during handling, bonding, and encapsulation operations, allowing the die to be processed successfully at reduced thickness.
2Length of moving object
If the die thickness is reduced, then the package becomes more compact, but the die material bends under various forces during processing
Solution Approach 1:
The temporary support structure is applied to the thinned die before packaging operations to prevent warpage during processing. The support structure is placed in advance to counteract the warping forces that occur when the die is handled, bonded, or encapsulated, thereby enabling successful processing of thinned dies without requiring additional thinning steps.
Solution Approach 2:
The temporary support structure functions as a flexible reinforcement layer that is applied to the thinned die. This thin film or shell-like structure provides additional mechanical strength to counteract bending forces during processing, enabling the die to maintain its shape and integrity at reduced thickness without permanent deformation.
3Reliability
If a temporary support structure is added to reduce warpage, then processing success is improved, but the device complexity increases
Solution Approach 1:
The temporary support structure is designed as a disposable, low-cost component that is applied to the die for the duration of packaging operations and then removed. This temporary structure provides the necessary mechanical support during processing but is not part of the final product, thereby adding minimal complexity to the finished device while ensuring processing success.
Solution Approach 2:
The temporary support structure is applied to the die, performs its function of preventing warpage during packaging operations, and is then removed or discarded. This temporary addition provides the necessary structural support during processing but is eliminated before the final product is completed, thereby minimizing the impact on device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The temporary die support structure effectively reduces warpage to desired thresholds, enabling successful processing and packaging of semiconductor dies by providing mechanical stability and support during critical operations.
Implementation Method 1
The temporary die support structure may be configured to be removable by one of exposure to light, ultrasonic energy, peeling, etching, grinding, or any combination thereof
Implementation Method 2
The temporary die support structure may be configured to be removable by one of exposure to light, ultrasonic energy, peeling, etching, grinding, or any combination thereof
Data Source
AI summary
Implementations of a semiconductor device may include a semiconductor die comprising a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and a temporary die support structure coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof. The thickness may be between 0.1 microns and 125 microns. The warpage of the semiconductor die may be less than 200 microns.