Temporary Fixation Film Modulus Control for Clean Semiconductor Debonding
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Solution Overview
Problem
Existing semiconductor processing technologies fail to efficiently remove elemental mercury (Hg0) from flue gas and oxidized mercury (Hg2+) from waste liquid, with activated carbon injection technology being costly and its mercury removal efficiency affected by NOx and SO2.
Innovation Solution
The solution involves the use of a method for producing a semiconductor device that includes a laminated semiconductor device, comprising a semiconductor member, a support member, and a material layer for temporary fixing formed from a film for temporary fixing, which includes a curable resin component with specific storage moduli ranges and a laminated body for temporary fixing, using incoherent light to separate the semiconductor member from the support member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a material layer for temporary fixing is used to strongly fix the semiconductor member to the support member, then the semiconductor member can be securely held during processing, but the resin components may creep up on the semiconductor member and fail to sufficiently embed surface unevenness
Solution Approach 1:
The patent applies parameter changes by controlling the storage modulus of the curable resin component within specific ranges (1.5 to 20 MPa at 270°C and 1.5 to 150 MPa at 25°C). This precise parameter control allows the material to provide sufficient fixing strength while maintaining the ability to embed surface unevenness and suppress resin creeping, resolving the contradiction between strong fixation and manufacturing precision.
2Reliability
If the semiconductor member is strongly fixed to the support member using the material layer for temporary fixing, then processing can be performed stably, but peeling residue may remain on the semiconductor member after separation
Solution Approach 1:
The patent resolves this contradiction by optimizing the storage modulus parameters of the curable resin component at different temperatures. The specific range (1.5 to 150 MPa at 25°C) ensures that the material provides reliable fixing during processing while allowing clean separation with minimal peeling residue, thus maintaining both processing stability and peeling cleanliness.
3Manufacturing precision
If resin components in the material layer for temporary fixing are used to embed surface unevenness, then good contact is achieved, but resin components may creep up on the semiconductor member
Solution Approach 1:
The patent addresses this contradiction through parameter changes by setting the storage modulus of the curable resin component within specific ranges. This control allows the resin to flow sufficiently to embed surface unevenness and achieve good contact quality, while simultaneously suppressing excessive resin creeping on the semiconductor member by maintaining the modulus within the specified parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses resin component creeping on the semiconductor member and reduces peeling residue, enhancing product yield and encapsulant filling, while maintaining encapsulant integrity and reducing residue adherence.
Implementation Method 1
This film for temporary fixing contains a curable resin component
Implementation Method 2
methods of separating the semiconductor member by irradiating the material layer for temporary fixing with laser light (coherent light) are disclosed
Data Source
AI summary
A film for temporary fixing used for temporarily fixing a semiconductor member and a support member contains a curable resin component. The storage modulus at 270° C. after curing of the film for temporary fixing is 1.5 to 20 MPa. The storage modulus at 25° C. after curing of the film for temporary fixing is 1.5 to 150 MPa.