Temporary Fixation Resin Layer for Wafer Separation by Incoherent Light
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Solution Overview
Problem
Current semiconductor device manufacturing methods for separating semiconductor members from supporting members using thermal or laser-based techniques face issues such as damage from thermal history, low product yield, and the need for expensive and complex equipment.
Innovation Solution
A semiconductor device manufacturing method involving a laminated body with a supporting member, a temporary fixation material layer that generates heat upon light absorption, and a semiconductor member, where the temporary fixation material layer is irradiated with incoherent light to facilitate easy separation, using a curable resin composition with electroconductive particles that absorb light and generate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal heating method is used to separate semiconductor member from supporting member, then separation can be achieved, but damage occurs in semiconductor wafer due to thermal history and product yield decreases
Solution Approach 1:
The patent changes the separation mechanism from thermal heating to light absorption. The temporary fixation material layer is designed to absorb specific wavelength light (e.g., infrared) and convert it to heat locally, raising its temperature above the glass transition temperature to enable separation without subjecting the semiconductor wafer to bulk thermal stress
Solution Approach 2:
The patent introduces a specialized temporary fixation material layer with specific light-absorbing properties positioned between the semiconductor wafer and supporting member. This layer selectively absorbs light energy and generates heat only in the adhesive interface region, enabling localized separation without thermal damage to the semiconductor wafer
2Reliability
If laser light is used to irradiate temporary fixation material layer for separation, then separation can be achieved, but the process becomes complicated and expensive due to need for scanning and focus control
Solution Approach 1:
The patent replaces the complex mechanical laser scanning and focus control system with a simpler optical illumination system. Instead of using coherent laser light that requires precise scanning mechanisms, the patent uses incoherent light sources that can illuminate the entire temporary fixation material layer simultaneously, eliminating the need for complex scanning hardware
Solution Approach 2:
The patent employs periodic or pulsed light irradiation to heat the temporary fixation material layer. By applying light in pulses or periodic cycles, the system achieves effective separation without requiring continuous complex scanning, simplifying the overall device architecture
3Reliability
If laser light is used for separation, then separation can be achieved, but it takes much time due to need to irradiate entire semiconductor member repeatedly for several times
Solution Approach 1:
The patent designs the temporary fixation material layer to absorb a broad spectrum of incoherent light, making the separation process independent of precise wavelength matching. This allows the entire layer to be heated simultaneously by uniform illumination, enabling single-pass separation without repeated irradiation cycles
Solution Approach 2:
The patent uses incoherent light sources that can illuminate the entire temporary fixation material layer simultaneously and continuously, eliminating the need for sequential scanning. This continuous illumination approach heats the entire adhesive layer at once, achieving separation in a single operation and significantly improving processing speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for efficient and damage-free separation of semiconductor members from supporting members, improving product yield and reducing the complexity and cost of the separation process.
Implementation Method 1
a temporary fixation material layer that generates heat upon absorbing light
Implementation Method 2
irradiating the temporary fixation material layer with incoherent light and thereby separating the semiconductor member from the supporting member
Data Source
AI summary
Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.