Temporary Fixing Material Light Absorption for Semiconductor Workpiece Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Workpieces, such as semiconductor wafers, can be degraded by light used in irradiation separation methods, as the separation layer degrades due to heat during processing, leading to insufficient light absorption and exposure of the workpiece to degrading radiation.
Innovation Solution
A workpiece treating method involving a temporary fixing material with a separation layer containing a polymer with a structural unit that absorbs light, maintaining low light transmittance even after heat treatment, preventing light from reaching the workpiece and enabling easy separation by reducing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a separation layer is used to absorb light and prevent workpiece degradation, then the workpiece is protected from photo-degradation, but the separation layer itself is degraded by heat during processing treatment and loses its light absorption capability
Solution Approach 1:
The temporary fixing material is divided into two distinct functional layers: a separation layer containing light-absorbing polymer for light absorption and adhesion reduction, and an adhesive layer for providing bonding force. This segmentation allows each layer to specialize in its function without interfering with the other's performance under heat treatment.
Solution Approach 2:
The adhesive layer acts as an intermediary between the separation layer and the workpiece, providing the necessary bonding force while allowing the separation layer to focus on light absorption and adhesion reduction functions without being directly exposed to the workpiece.
2Illumination intensity
If the separation layer absorbs light to protect the workpiece, then light transmittance is reduced, but the separation layer degrades due to heat treatment and fails to maintain low light transmittance
Solution Approach 1:
The patent specifies particular polymer structures (formulas A1 and A2 with condensed polycyclic aromatic rings) that have inherent thermal stability, allowing them to maintain their light absorption properties even after heat treatment during processing.
Solution Approach 2:
The temporary fixing material combines the light-absorbing polymer with specific adhesive components to create a composite structure that maintains both light absorption capability and thermal stability during processing treatment.
3Strength
If a temporary fixing material is used to hold the workpiece during processing, then the workpiece can be securely positioned, but the material must be separated after processing which requires additional steps
Solution Approach 1:
The light-absorbing polymer undergoes phase transition or chemical change when exposed to light, causing a reduction in adhesion between the temporary fixing material and the workpiece, enabling easy separation after processing without requiring additional mechanical or chemical steps.
Solution Approach 2:
The patent replaces mechanical separation methods with optical separation: light irradiation triggers the polymer to reduce adhesion, allowing separation through optical energy rather than mechanical force, which simplifies the separation process and improves productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents photo-degradation of workpieces by ensuring the separation layer maintains low light transmittance and adhesion reduction, allowing for effective separation without damaging the workpiece during processing.
Implementation Method 1
a separation layer that contains a light-absorbing polymer
Implementation Method 2
applying light to the layer (I) through the support... applying light to the temporary fixing material that has formed a stack together with a support and a workpiece so as to reduce the adhesion
Data Source
AI summary
In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.