Temporary Fixing Material for Semiconductor Substrate
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Solution Overview
Problem
Existing temporary fixing materials for semiconductor substrates lack solvent resistance, restricting the choice of resins that can be used, especially when high polarity solvents are involved in processing, and fail to provide adequate heat resistance during high-temperature processes.
Innovation Solution
A substrate treating method using a temporary fixing material with a central section and a peripheral section, where the peripheral section exhibits excellent solvent resistance and the central section has multiple layers with high melting temperatures, allowing for the use of resins like polyimides and polyether sulfones that are not resistant to solvents like N-methyl-2-pyrrolidone, and enabling separation by heating the residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If resins with high melting temperature are used to achieve heat resistance, then heat resistance is improved, but solvent resistance deteriorates
Solution Approach 1:
The temporary fixing material is divided into a first temporary fixing material layer and a second temporary fixing material layer. The first layer (closer to substrate) uses high melting temperature resin for heat resistance, while the second layer (closer to support) uses solvent-resistant resin for solvent resistance during processing
Solution Approach 2:
Different regions of the temporary fixing material have different properties: the first layer has high heat resistance for protecting bumps, while the second layer has high solvent resistance for maintaining adhesion during processing. Each layer is optimized for its specific function
2Device complexity
If a single-layer temporary fixing material is used, then the structure is simple, but it cannot simultaneously provide both heat resistance and solvent resistance
Solution Approach 1:
The temporary fixing material is segmented into two functional layers, allowing independent selection of resins for each layer based on specific requirements (heat resistance vs. solvent resistance), thereby expanding resin selection flexibility
Solution Approach 2:
The temporary fixing material uses a composite structure with two different resin systems, combining the advantages of high melting temperature resins and solvent-resistant resins in a single material system
3Reliability
If the peripheral section uses solvent-resistant resin, then solvent resistance is improved, but the choice of resins for the central section is restricted
Solution Approach 1:
The temporary fixing material is divided into peripheral section (second layer with solvent-resistant resin) and central section (first layer with high melting temperature resin), allowing independent resin selection for each section based on local requirements
Solution Approach 2:
The peripheral section has solvent-resistant properties for maintaining adhesion at edges, while the central section has high heat resistance for protecting bumps. This local differentiation expands overall resin selection flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a wide choice of resins to protect substrates during processing, maintains holding power at high temperatures, and facilitates easy separation of the substrate from the support, enhancing heat resistance and solvent resistance properties.
Implementation Method 1
a step of dissolving at least the peripheral section (B) of the temporary fixing material with a solvent
Implementation Method 2
a step of heating the residue of the temporary fixing material and separating the substrate from the support
Data Source
AI summary
A method that includes, in the sequence set forth, (1) temporarily fixing a substrate onto a support via a temporary fixing material including a central section (A) having two or more layers and a peripheral section (B) with solvent resistance, section (B) being in contact with a peripheral portion of the support on the substrate side and with a peripheral portion of the substrate on the support side, section (A) being in contact with a central portion of the support on the substrate side and with a central portion of the substrate on the support side, the temporary fixing thus resulting in a stack in which section (A) is covered with the support, section (B) and the substrate; (2) processing the substrate and/or transporting the stack; (3) dissolving section (B) with a solvent; and (4) heating the residue of the temporary fixing material and separating the substrate from the support.