Temporary Fixing Resin Composition for Coreless Substrate Reflow
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Solution Overview
Problem
Existing methods for stacking semiconductor elements face challenges in securing rigidity and handleability of coreless substrates during production processes, with issues of peeling and warpage, particularly during reflow processes, and the temporary fixing materials used in these processes often remain on the substrate post-reflow.
Innovation Solution
A resin composition for temporary fixing is developed, containing a thermoplastic resin, a thermosetting resin, and an inorganic filler, which forms a film with an elastic modulus of 350 to 550 MPa at 25°C, effectively suppressing peeling during reflow and enabling easy peelability post-reflow, while maintaining adhesive strength and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a coreless substrate is used to reduce thickness, then substrate thickness is reduced, but substrate rigidity deteriorates
Solution Approach 1:
A support tape is introduced as an intermediary element to provide mechanical support to the thin coreless substrate during handling and processing. The support tape has high rigidity and strength, compensating for the substrate's lack of rigidity without requiring changes to the substrate's core structure.
Solution Approach 2:
The system forms a composite structure combining the coreless substrate with the support tape. This composite provides both the thin profile needed for high-capacity stacking and the mechanical strength required for handling, as the support tape carries the mechanical loads while the substrate maintains its thin design.
2Ease of operation
If a support tape is bonded to substrate with temporary fixing material, then substrate handleability is improved, but peeling occurs during reflow process
Solution Approach 1:
The temporary fixing material's bonding parameters are specifically designed to provide strong adhesion at room temperature for easy handling, while its thermal properties cause the bond to weaken or reversibly break during reflow heating. This parameter change with temperature allows the material to provide support when needed and release when required.
Solution Approach 2:
The bonding characteristics of the temporary fixing material are made dynamic rather than static - the bond strength changes with temperature conditions. During assembly and handling, the bond is strong; during reflow, the bond becomes weak or releases, allowing the support tape to be removed without damaging the substrate.
3Strength
If temporary fixing material is used to secure rigidity, then substrate rigidity is improved, but material remains on substrate after removal
Solution Approach 1:
The temporary fixing material is designed as a disposable, single-use component that provides its function during critical handling and processing stages, then is easily removed without contamination. The material is formulated to leave no residue on the substrate, making it suitable for high-precision electronic applications where contamination must be avoided.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition ensures stable bonding and easy removal of the temporary fixing material from the substrate, enhancing handleability and productivity in semiconductor element production without substrate contamination.
Implementation Method 1
the film after being heated for 30 minutes at 130° C. and for 2 hours at 170° C. has an elastic modulus of 350 to 550 MPa at 25° C.
Implementation Method 2
the resin composition for temporary fixing containing a thermoplastic resin, a thermosetting resin, and an inorganic filler
Implementation Method 3
there is a problem that peeling between the support and the substrate (between the support and the temporary fixing material or between the temporary fixing material and the substrate), or foam that become the starting points of peeling are likely to occur
Data Source
AI summary
A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.