Temporary Fixing Resin for High-Temperature Wafer Separation
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Solution Overview
Problem
Conventional adhesive compositions and tapes used for fixing electronic components during high-temperature processing at 300°C or higher suffer from voids and partial detachment, and fail to maintain separability without adhesive deposits.
Innovation Solution
A curable resin composition containing a maleimide group-containing reactive compound and a resin with an imide skeleton in the backbone repeating unit, which polymerizes and crosslinks upon heating or light irradiation, reducing voids and partial detachment, and facilitating easy separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesive compositions or tapes are used to fix electronic components during high-temperature processing at 300°C or higher, then the electronic components can be firmly fixed, but voids and partial detachment occur between the adhesive and support, and adhesion increases leading to insufficient separability and adhesive deposits
Solution Approach 1:
The adhesive composition uses a polymer with specific glass transition temperature (Tg) of 80°C or higher, and incorporates polyfunctional monomers or oligomers with radiation polymerizable functional groups. By controlling the Tg parameter and chemical composition, the adhesive maintains firm fixation during high-temperature processing while enabling easy separation through UV irradiation that reduces adhesion without causing damage or adhesive deposits
Solution Approach 2:
The adhesive composition is formulated as a composite system combining a polymer base with polyfunctional monomers or oligomers containing radiation polymerizable functional groups. This composite structure provides both high adhesiveness for firm fixation and radiation-induced separability, resolving the contradiction between strong bonding and easy separation
2Strength
If polyimide resin adherends are fixed to inorganic material supports using conventional adhesive compositions, then the adherends can be protected during processing, but the adhesive composition fails to reduce the rise in adhesion to polyimide resin adherends at high temperatures
Solution Approach 1:
The adhesive composition is designed with a polymer having glass transition temperature of 80°C or higher, which specifically addresses the high-temperature interaction with polyimide resin adherends. This parameter control prevents excessive adhesion rise during high-temperature processing while maintaining adequate bonding strength
Solution Approach 2:
The adhesive composition acts as an intermediary layer between the inorganic support and polyimide resin adherend. The specific polymer composition with high Tg and radiation polymerizable groups mediates the thermal and adhesive interaction, preventing direct harmful thermal contact while controlling adhesion characteristics
3Ease of operation
If adhesive compositions are used to fix thick wafers to supports for thinning processes, then the wafers can be handled easily and protected from breakage, but voids and partial detachment occur during high-temperature processing
Solution Approach 1:
The adhesive composition uses a polymer with glass transition temperature of 80°C or higher, which maintains bonding integrity during high-temperature processing. This parameter selection ensures that the adhesive remains effective both for easy handling during wafer transfer and for maintaining bonding integrity during subsequent high-temperature thinning processes without voids or partial detachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin composition effectively prevents voids and partial detachment during high-temperature processing, ensuring easy separation without adhesive deposits, while maintaining adhesion to polyimide adherends.
Implementation Method 1
a maleimide group-containing reactive compound (1) and a resin (2) having an imide skeleton in a backbone repeating unit
Implementation Method 2
polymerizes and crosslinks upon heating or irradiation
Implementation Method 3
an adhesive composition or tape used with electronic components are required to have high adhesiveness to firmly fix electronic components
Data Source
AI summary
The present invention aims to provide a curable resin composition that can reduce the occurrence of voids and partial detachment between the composition and a support even in high-temperature processing at 300° C. or higher with an adherend fixed to the support with the composition, and is easily separable after the high-temperature processing. The present invention also aims to provide a temporary fixing material including an adhesive layer containing the curable resin composition and a method of producing an electronic component using the temporary fixing material. Provided is a curable resin composition containing: a maleimide group-containing reactive compound (1); and a resin (2) having an imide skeleton in a backbone repeating unit.