Temporary Assembly Interface for High-Temperature Handle Release
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Solution Overview
Problem
Current methods for temporarily assembling microelectronic elements, such as handling handles and microelectronic supports, face challenges in separating these elements easily while maintaining resistance to high temperatures and allowing for reusability of the handle, as existing bonding techniques are either temperature-limited or permanent.
Innovation Solution
A stack of layers is used, where one layer emits chemical species during a physicochemical treatment to weaken the interface, enabling easy separation without the need for organic bonding materials, allowing for temperatures above 400°C and enabling handle reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If organic bonding materials are used to assemble the handle and substrate, then the handle can be removed by simple heating to around 200°C, but the bonding cannot be used if processes are to be carried out at temperatures above 350°C-400°C
Solution Approach 1:
A thin film layer is introduced as an intermediary between the handle and substrate. This thin film can be selectively removed or weakened to enable handle removal without requiring high-temperature heating of organic bonding materials, thereby allowing subsequent high-temperature processing steps
Solution Approach 2:
The bonding interface is designed such that the thin film's properties change at specific conditions (e.g., becoming removable through chemical etching, mechanical fracture, or selective dissolution), enabling handle removal without thermal heating that would limit process temperatures
2Temperature
If direct or metallic/eutectic bonding is used to assemble the handle and substrate, then the bonding is resistant to temperatures above 400°C, but the handle bonding is permanent and the handle cannot be removed without destroying it
Solution Approach 1:
The bonding interface is segmented into multiple layers, with a thin film layer positioned between the handle and substrate. This segmentation allows the thin film to serve as a sacrificial or removable element, enabling handle detachment while the underlying metallic bonding provides high-temperature stability
Solution Approach 2:
The thin film is designed as a temporary, consumable element that is removed after serving its purpose of enabling high-temperature bonding. This disposable layer facilitates permanent high-temperature resistant bonding while still allowing handle removal through selective elimination of the thin film
3Ease of manufacture
If thin film transfer processes with gaseous species implantation are used, then thin films can be transferred to substrates, but the process is relatively complex because it includes the step of implantation of gaseous species
Solution Approach 1:
The complex gaseous species implantation step is extracted and replaced with a simpler thin film deposition or formation process. The thin film is created through more straightforward methods such as chemical vapor deposition, physical vapor deposition, or solution-based techniques, eliminating the need for complex ion implantation equipment and procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for efficient separation of microelectronic elements at high temperatures without the need for costly bonding materials, enabling cost and time savings by allowing handle reuse and improved material handling in microelectronic processes.
Implementation Method 1
a first layer (C1) and a second layer (C2), the first layer being capable of emitting by degassing a chemical species during a physicochemical treatment
Implementation Method 2
the second layer being capable of receiving said species so as to mechanically weaken the interface
Data Source
Figure 1~3B
Figure 4A~5B
Figure 6A~6E
AI summary
Method for making a temporary assembly interface for a microelectronic support and a handle, comprising at least: - the formation of a first layer comprising at least one material capable of releasing at least one chemical species under the action of a physico-chemical treatment, - the formation of a second layer comprising at least one material capable of receiving at least one chemical species so as to cause its embrittlement, - the embrittlement of the interface by application of a heat treatment, such that at least one species is released from the first layer and reacts with all or part of the material of the second layer.