Temporary Panel Bonding for Thinner Multi-Substrate Electronics
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Solution Overview
Problem
The challenge is to create a manufacturing method for electronic devices with multiple panels that results in a thinner and lighter product, as existing methods increase overall thickness and weight due to the inclusion of multiple panels.
Innovation Solution
The method involves using temporary panels with carrier boards and substrates arranged in sequence, followed by the removal of certain carrier boards and the fixation of substrates using an attaching member, allowing for a more compact electronic device design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple panels are included in the electronic device, then the device functionality is enhanced, but the overall thickness and weight increase
Solution Approach 1:
The patent merges multiple panels (first panel with display area and second panel with touch area) into a single integrated structure where the panels are bonded together through the peripheral circuit area. This combining approach allows multiple functional panels to work together while sharing common structural support, thereby enhancing device functionality without proportionally increasing weight.
Solution Approach 2:
The patent implements a nested structure where the second panel is positioned over the first panel, and both panels are supported by the same peripheral circuit area structure. The supporting component with greater thickness provides a common foundation that nests both panels together, allowing them to occupy overlapping spatial volumes and reducing overall device weight compared to separate panel assemblies.
2Adaptability or versatility
If multiple panels are included in the electronic device, then the device functionality is enhanced, but the overall thickness increases
Solution Approach 1:
The patent resolves the thickness issue by transitioning from a stacked arrangement to an overlapping planar arrangement. The panels are positioned such that they overlap in the horizontal plane rather than being stacked vertically, allowing the supporting component to extend in the thickness dimension perpendicular to the panel planes. This dimensional reorganization enables multiple panels to coexist without adding proportional thickness to the device.
Solution Approach 2:
The patent segments the device structure into distinct functional zones: display area, peripheral circuit area, and touch area. By segmenting the supporting component to provide targeted support in the peripheral circuit area, the structure enables multiple panels to be integrated without requiring uniform thickness throughout, allowing optimization of local thickness where panels overlap.
3Length of stationary object
If carrier boards are removed and substrates are fixed directly, then the device thickness is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by providing the attaching member before removing the second carrier board. The attaching member is positioned to engage with the second substrate in advance, so that when the carrier board is removed, the substrates are already prepared for direct fixation. This preliminary preparation simplifies the manufacturing process despite the direct bonding approach, as the attaching member is pre-positioned to guide the bonding operation.
Data Source
AI summary
A manufacturing method manufactures an electronic device, and includes the steps of: providing a first temporary panel including a first carrier board, a first substrate, a second substrate and a second carrier board arranged in sequence; providing a second temporary panel including a third carrier board, a third substrate, a fourth substrate and a fourth carrier board arranged in sequence; and removing the second carrier board and the third carrier board, and fixing the second substrate and the third substrate with an attaching member.