Tenon-and-mortise stacked package structure for precise alignment
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Solution Overview
Problem
The manufacturing process of chip-in-polymer (CIP) packages faces challenges in yield rate due to non-uniformity of the dielectric layer and adhesive detachment during heating cycles, and precise positioning of stacked packages is difficult, affecting the overall efficiency and reliability of the packaging structure.
Innovation Solution
A tenon-and-mortise packaging structure is introduced, where tenon projections and mortise slots on opposite surfaces of substrates enable precise alignment and electrical connection without additional devices, reducing circuit space and eliminating the need for a dielectric layer, thus enhancing yield rate and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dielectric layer is formed via spin-coating to embed chips, then chip embedding is achieved, but the uniformity of the dielectric layer becomes hard to control affecting yield rate
Solution Approach 1:
The patent removes the dielectric layer entirely from the packaging structure. Instead of embedding chips in a dielectric layer formed by spin-coating, the invention uses a mechanical interlocking structure where chips are directly mounted on the substrate surface and secured through tenon-mortise coupling between stacked substrates, eliminating the problematic dielectric layer formation process
Solution Approach 2:
The patent replaces the chemical/mechanical process of dielectric layer formation and chip embedding with a purely mechanical interlocking system. The tenon projections and mortise slots provide precise mechanical positioning and secure coupling without requiring uniform dielectric layers, substituting a controllable mechanical system for an uncontrollable material deposition process
2Strength
If adhesive is used to fix embedded chips to form stacked package, then chips are secured, but adhesive may detach and come off after repeated heating cycling
Solution Approach 1:
The patent employs geometric interlocking through tenon projections and mortise slots that create a mechanical key-lock system. This geometric constraint provides inherent mechanical strength and positioning that does not rely on adhesive bonding, eliminating the problem of adhesive detachment during thermal cycling
Solution Approach 2:
The patent replaces the chemical bonding mechanism of adhesive with a mechanical interlocking system. The tenon-mortise coupling provides secure physical attachment through geometric constraints and friction, offering reliable bonding that is insensitive to thermal cycling conditions that cause adhesive failure
3Reliability
If additional devices are used for electrical connection in stacked package, then electrical connection is achieved, but circuit required space increases
Solution Approach 1:
The patent combines multiple functions into the substrate structure itself. The tenon projections and mortise slots simultaneously provide mechanical positioning, structural coupling, and electrical connection pathways. Conduction portions are integrated directly into the tenon and mortise structures, eliminating the need for separate electrical connection devices and reducing overall circuit space
Solution Approach 2:
The tenon-mortise structure serves multiple functions: mechanical interlocking for positioning, structural support for stacking, and electrical conduction between layers. This multi-functional design eliminates the need for dedicated electrical connection components, optimizing space utilization while maintaining reliable electrical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tenon-and-mortise packaging structure ensures precise positioning of stacked packages, reduces required circuit space, and improves electrical properties by eliminating non-uniformity issues associated with dielectric layers, thereby increasing the yield rate and reliability of the CIP package.
Implementation Method 1
a plurality of conduction portions are electroplated on the surface of the tenon projection and the inner side of the mortise slot for electrically connecting between the substrates
Data Source
AI summary
A tenon-and-mortise packaging structure including a carrier and a chip is provided. The carrier has a top surface and a lower surface opposite to the top surface. The top surface forms at least one tenon projection, and the lower surface forms a mortise slot corresponding to the tenon projection in shape, size, and position, so that two carriers can be stacked on and jointed to each other by coupling the tenon projection to the corresponding mortise slot. The tenon projection and the mortise slot have conduction portions, respectively. When the tenon projection and the mortise slot are engaged with each other, the conduction portions are electrically connected with each other. At least one chip is embedded in the carrier. The chip has an active surface and a back side respectively and electrically connected with the top and the lower surfaces of the carrier.