Tensioned Intra-Dewar Spider Assembly for Cryogenic Support
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Solution Overview
Problem
Traditional cryogenic Dewar systems face challenges in supporting large cryogenically cooled components without adding significant thermal load, overstressing the coldfinger, or failing to isolate components from vibrations, especially when the coldfinger's structural and vibrational support is insufficient.
Innovation Solution
A tensioned intra-Dewar spider assembly using thin titanium alloy members arranged in a rotationally symmetric configuration to provide structural support while minimizing thermal conductivity, with preloading to maintain stiffness and alignment, and using a combination of attachment methods like screws and welding to secure the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the coldfinger structure is used to support large cryogenic components, then structural support is provided, but thermal load increases and structural stress increases
Solution Approach 1:
The patent introduces an intermediary support structure (spider assembly with thin members) between the coldfinger and the large cryogenic components. This intermediary structure provides the necessary mechanical support while minimizing thermal conduction paths, thus reducing the thermal load on the cryocooler while maintaining structural support capability.
Solution Approach 2:
The support function is segmented into two parts: the coldfinger provides primary structural support and positioning, while the thin-member spider assembly provides additional support for large components. This segmentation allows each element to be optimized for its specific function, with the thin members contributing minimal thermal load.
2Strength
If the coldfinger structure is used to support large cryogenic components, then structural support is provided, but the coldfinger becomes overstressed
Solution Approach 1:
The spider assembly acts as an intermediary support structure that shares the mechanical load with the coldfinger. By distributing the weight and forces to additional support members, the stress on the coldfinger is reduced while maintaining overall structural support capability.
3Strength
If traditional support structures are used, then components are supported, but vibrational isolation is insufficient
Solution Approach 1:
The patent uses thin, flexible support members that provide mechanical support while naturally damping vibrations. These thin members act as vibration isolators, reducing the transmission of vibrational energy from the coldfinger to the sensitive cryogenic components while maintaining structural support.
4Strength
If additional support structures are added to support more hardware, then support capability increases, but parasitic heat load increases
Solution Approach 1:
The thin-member spider assembly provides additional support capability while minimizing parasitic heat load. The thin cross-section of these members creates long thermal conduction paths with low thermal conductivity, allowing the structure to support more hardware without significantly increasing the thermal burden on the cryocooler.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively supports cryogenically cooled components with minimal thermal load, maintains alignment, and isolates them from vibrations, enhancing structural integrity and reducing parasitic heat while maintaining low mass and weight sensitivity.
Implementation Method 1
minimizing the additional parasitic heat load it adds to the cryocooler because of the additional thermal paths to warm components introduced by the supporting structure
Data Source
AI summary
A tensioned intra-Dewar spider assembly that can support a large system inside the Dewar in a way that adds as little thermal load as possible, doesn't overly stress the coldfinger, maintains alignment, and isolates the components from the vibrations of the cryocooler is disclosed.