Tensioned Socket Gimbal for Even DUT Thermal Contact
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Solution Overview
Problem
Conventional DUT testing methods using multiple cold plates and air-cooled superstructures are costly and complex, failing to provide the thermal performance of liquid-cooled solutions, which are necessary for efficient testing of high-powered devices.
Innovation Solution
Implementing liquid-cooled thermal arrays with gimbal features that allow surfaces to pivot into secure and even contact, preventing air gaps and enhancing thermal performance, thereby enabling more parallel testing within a small space with reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple cold plates are used per tester, then cooling capacity is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines multiple cold plates into a single integrated thermal array that can cool multiple DUTs simultaneously. The thermal array is divided into multiple zones, each capable of cooling a DUT, but all managed as one unified system rather than separate cold plates for each device.
Solution Approach 2:
The thermal array serves multiple functions: it provides cooling to multiple different DUTs, acts as a structural support platform, and enables parallel testing of multiple devices. This multi-functional design replaces the need for dedicated cold plates for each DUT.
2Device complexity
If air cooled superstructures are used, then device complexity is reduced, but thermal performance deteriorates
Solution Approach 1:
The patent employs liquid cooling through the thermal array instead of air cooling. Fluid channels are integrated into the thermal array structure, allowing efficient heat removal from multiple DUTs simultaneously, providing thermal performance comparable to traditional liquid-cooled cold plates.
3Ease of manufacture
If conventional cooling methods are used, then implementation is simpler, but thermal transfer efficiency deteriorates
Solution Approach 1:
The socket structure incorporates a gimbal mechanism with tension springs that allows the socket to pivot and conform to the thermal array surface. This flexibility ensures intimate thermal contact between the DUT and the thermal array, maximizing thermal transfer efficiency while maintaining ease of implementation.
4Productivity
If more DUTs are tested in parallel, then productivity increases, but device complexity increases
Solution Approach 1:
The thermal array is segmented into multiple cooling zones, and the socket structure is divided into multiple individual sockets, each with its own gimbal mechanism. This segmentation allows multiple DUTs to be tested in parallel while each component remains relatively simple in design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves thermal transfer and cooling capacity while reducing overall test system costs and complexity, allowing for efficient testing of multiple DUTs in parallel.
Implementation Method 1
a socket structure coupled to a spring and operable to receive a DUT, the spring coupled to a baseplate, the spring being under tension
Implementation Method 2
a thermal array including arms operable to lift the socket structure to bring the DUT into even and secure contact with the thermal array during operation to cool the DUT
Implementation Method 3
liquid cooled thermal arrays (or refrigerant cooled thermal arrays)
Data Source
AI summary
Embodiments of the present invention provide a gimbaling socket structure that uses tension to bring a device under test (DUT) disposed in the socket into secure contact with a liquid cooled thermal array or the like to cool the DUT during testing. The gimbaling socket structure is secured to a tension spring and can move freely in 3 dimensions to bring the surfaces of the DUT and the thermal array (or components thereof, such as TEC/ATI layers) into even, level, and secure contact with each other, thereby preventing air gaps between surfaces and improving thermal performance. The even, secure contact between surfaces improves thermal cooling and reduces variation in cooling efficiency. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices.