Terahertz Measurement Apparatus for Layer Adhesion Detection

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Solution Overview

Problem

Current methods for measuring the state of adhesion between layers suffer from low measurement accuracy due to limited depth resolution and safety concerns, making it difficult to detect voids and adhesive strength effectively.

Innovation Solution

A measurement apparatus that uses terahertz or millimeter waves to detect evanescent waves at the interface between layers, allowing for improved depth resolution and accuracy by totally reflecting electromagnetic waves between layers, and includes a displacer to assess contact states, thereby enhancing the detection of the third layer's presence and thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional reflection or transmission measurement methods are used, then the measurement can be performed with simple equipment, but the measurement accuracy and depth resolution are insufficient to detect the third layer and assess adhesion state

Engineering Contradiction:
Improvedepth resolutionVSAvoidmeasurement system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent changes the parameter of electromagnetic wave incidence angle to achieve total internal reflection at the interface between the first layer and the third layer. By setting the incidence angle greater than the critical angle, the system generates evanescent waves that extend into the third layer, enabling detection of adhesion state with depth resolution equal to or less than the wavelength of the electromagnetic wave.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces conventional mechanical contact-based adhesion testing methods with electromagnetic wave-based non-contact measurement. The generator emits electromagnetic waves that interact with the layered structure, and the receiver detects reflected waves to assess adhesion state, eliminating the need for physical contact or complex mechanical testing apparatus.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If the electromagnetic wave is incident at a normal angle for simple measurement, then the measurement setup is simple, but the wave penetrates through the layers without total reflection, preventing detection of the third layer

Engineering Contradiction:
Improvedetection of third layerVSAvoidmeasurement setup complexity
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The patent changes the incidence angle parameter from normal incidence to oblique incidence greater than the critical angle. This parameter change enables total internal reflection at the first layer-third layer interface, generating evanescent waves that penetrate into the third layer and allow its detection through the receiver, while maintaining a relatively simple optical setup.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If the displacer is used to displace layers to assess contact state, then the adhesion assessment becomes more accurate, but the device complexity increases

Engineering Contradiction:
Improveadhesion state assessment accuracyVSAvoiddevice structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent introduces a displacer as an intermediary component that applies controlled displacement or force to the layers. This displacer serves as a mediator between the measurement system and the sample, enabling the assessment of adhesion state by observing how the layers respond to applied displacement while keeping the overall device structure relatively simple.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus significantly improves the measurement accuracy of the state of adhesion between layers by enabling detection with a depth resolution equal to or less than the wavelength of the electromagnetic wave, allowing for precise assessment of contact states and adhesive strength.

Implementation Method 1

the generator is configured to cause the electromagnetic wave to be incident at an angle such that the electromagnetic wave is totally reflected between the first layer and the third layer and/or between the first layer and the second layer

Methodology Applied
Scientific EffectTotal reflection: Total Internal Reflection

Implementation Method 2

an evanescent wave (near-field light) localized in the region of approximately the wavelength of the electromagnetic wave enables detection of the third layer, located near the interface between the first and second layers

Methodology Applied
Scientific EffectEvanescent wave:

Data Source

PatentUS11933726B2Measurement apparatus and measurement method
Publication Date: 2024.03.19 YOKOGAWA ELECTRIC CORP
  • US11933726B2 patent drawing
  • US11933726B2 patent drawing
  • US11933726B2 patent drawing

AI summary

A measurement apparatus includes a generator that causes electromagnetic waves to be incident on a sample, a receiver that receives electromagnetic waves reflected by the sample, and a controller that controls the generator and receiver. The sample includes a first layer on which the electromagnetic waves are incident and a second layer stacked on the first layer. The controller detects whether a third layer is present between the first and second layers based on the electromagnetic waves incident on the sample from the generator and the electromagnetic waves received by the receiver. The generator causes the electromagnetic waves to be incident at an angle such that the electromagnetic waves are totally reflected between the first and third layers and/or between the first and second layers.