Terahertz Interfacial Adhesion Measurement System
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Solution Overview
Problem
Current methods fail to nondestructively determine the adhesion strength between layers of a multilayer sample using electromagnetic radiation, as they do not effectively measure the interface properties between layers.
Innovation Solution
A system utilizing terahertz radiation, including a transmitter and receiver, digitizes reflected electromagnetic radiation to analyze waveform data, specifically comparing magnitudes to determine adhesive strength between layers, and identifies a fourth magnitude between reflection peaks to assess reduced adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electromagnetic radiation is used to measure material properties, then nondestructive testing is enabled, but adhesion strength between layers cannot be determined
Solution Approach 1:
The patent segments the measurement process by identifying and measuring reflection magnitudes from different interfaces (top surface, layer interface, bottom surface) separately. By analyzing the second magnitude (interface reflection) and third magnitude (bottom surface reflection) independently, the system can determine adhesion strength between layers without destructive testing, resolving the contradiction between nondestructive capability and measurement difficulty.
Solution Approach 2:
The patent uses reflected electromagnetic radiation as an intermediary carrier to transmit information about interface properties. The reflection magnitudes serve as intermediaries that indirectly indicate adhesion strength, allowing nondestructive measurement of a property that was previously difficult to measure without direct contact or destruction of the sample.
2Measurement precision
If destructive testing is used to determine adhesion strength, then accurate measurement is achieved, but sample destruction occurs
Solution Approach 1:
The patent replaces mechanical destructive testing methods with electromagnetic radiation-based nondestructive measurement. By using terahertz radiation to measure reflection magnitudes from interfaces, the system achieves accurate adhesion strength measurement without mechanical contact or sample destruction, eliminating the trade-off between measurement accuracy and sample integrity.
3Reliability
If reflection magnitudes are analyzed to determine adhesion strength, then nondestructive measurement is achieved, but measurement complexity increases
Solution Approach 1:
The patent extracts specific reflection magnitudes (second magnitude for interface reflection, third magnitude for bottom surface reflection) from the overall reflection data. By isolating and analyzing only these specific magnitudes rather than the complete waveform, the system simplifies the measurement process and reduces data analysis complexity while maintaining nondestructive measurement capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables nondestructive testing and analysis of adhesive strength between layers, providing accurate measurements of adhesion by analyzing reflection amplitudes and time-domain waveforms, effectively identifying changes in adhesion without destructive testing.
Implementation Method 1
a transmitter configured to output electromagnetic radiation to the sample, a receiver configured to receive electromagnetic radiation that was reflected by the sample
Implementation Method 2
The data acquisition device is configured to digitize the electromagnetic radiation reflected by or transmitted though the sample to yield waveform data
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A system for determining a material property at an interface between a first layer and a second layer includes a transmitter outputting electromagnetic radiation to the sample, a receiver receiving electromagnetic radiation that was reflected by or transmitted though the sample, and a data acquisition device. The data acquisition device is configured to digitize the electromagnetic radiation reflected by or transmitted though the sample to yield waveform data, wherein the waveform data represents the radiation reflected by or transmitted though the sample, the waveform data having a first magnitude, a second magnitude and a third magnitude. The material property to be determined is generally the adhesive strength between the first and second layers.