Terahertz Carrier Coupling Structure for Higher Bandwidth Links
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Solution Overview
Problem
Conventional terahertz communication systems suffer from low radiation gain and electromagnetic coupling efficiency, leading to reduced transmission bandwidth and increased power consumption due to the use of free-space radiation and optical-to-electrical conversion.
Innovation Solution
A terahertz carrier sending and receiving apparatus is designed with a radio frequency sending chip, mode conversion structure, and terahertz transmission line, incorporating dielectric layers and impedance matching structures to enhance electromagnetic coupling and improve data transmission bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a radiator on a radio frequency chip radiates a terahertz signal to a terahertz transmission line through free space, then the signal can be transmitted to a receiving end, but the radiation gain is low and electromagnetic coupling efficiency is low
Solution Approach 1:
The patent introduces a mode conversion structure as an intermediary component between the radio frequency chip radiator and the terahertz transmission line. This structure includes a dielectric layer with specific permittivity and thickness, along with metal ground layers and signal layers that facilitate efficient mode conversion. The intermediary structure transforms the electromagnetic field from the radiator into a mode suitable for the transmission line, significantly improving coupling efficiency and reducing energy loss compared to direct free-space radiation.
Solution Approach 2:
The patent employs parameter changes by carefully controlling the dielectric layer's permittivity (ranging from 2 to 10), thickness (specific ratios relative to other layers), and the metal layer configurations. These parameter optimizations enable efficient terahertz signal coupling into the transmission line while maintaining low loss, directly addressing the contradiction between coupling efficiency and transmission bandwidth.
2Speed
If optical cable is used for interconnection, then transmission rate can be achieved, but optical-to-electrical conversion is required which greatly increases power consumption and costs
Solution Approach 1:
The patent replaces the optical cable system with a terahertz transmission line system that operates entirely in the electromagnetic domain. By using a mode conversion structure that efficiently couples radio frequency signals directly into terahertz transmission modes, the invention eliminates the need for optical-to-electrical conversion components, thereby significantly reducing power consumption while maintaining high transmission rates.
3Ease of operation
If copper cable is used for short-range communication, then connection can be established, but increased metal loss largely limits transmission distance and transmission rate
Solution Approach 1:
The patent transitions from copper cable transmission to terahertz transmission line transmission by changing the operating frequency parameter and transmission medium. The mode conversion structure is designed with specific dielectric and metal layer parameters that minimize loss at terahertz frequencies, enabling long-distance, high-speed transmission without the metal loss limitations that constrain copper cables.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves efficient electromagnetic coupling, increasing data transmission bandwidth and reducing power consumption by optimizing the coupling efficiency between the radio frequency and terahertz signals.
Implementation Method 1
The mode conversion structure includes a metal inner wall, configured to couple a terahertz signal excited by the mode excitation structure into the terahertz transmission line
Implementation Method 2
the mode excitation structure includes a top metal layer and a bottom metal layer, and a dielectric layer is included between the top metal layer and the bottom metal layer
Data Source
AI summary
The present disclosure describes a terahertz carrier sending apparatus and a terahertz carrier receiving apparatus. The sending apparatus includes a radio frequency sending chip, a mode conversion structure, a terahertz transmission line, and a circuit board. The radio frequency sending chip is packaged on the circuit board, and includes a radio frequency sending circuit, a feed transmission line, and a mode excitation structure. The mode conversion structure includes a metal inner wall, configured to couple a terahertz signal excited by the mode excitation structure into the terahertz transmission line. The terahertz transmission line is configured to transmit the terahertz signal. The receiving apparatus includes a similar part in a receiving direction. The subject matter herein implements efficient electromagnetic coupling and improves data transmission bandwidth.