Terahertz Radiation Curtain for Non-Contact Extrusion Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for measuring the dimensional properties of elongated and flat industrial products, such as tubes, cables, and sheets, face inaccuracies and health hazards due to mechanical contact, optical defocusing, and the need for special handling in non-contact methods like ultrasonic and radioactive techniques.
Innovation Solution
The use of a curtain of terahertz radiation that sweeps across moving products to measure diameter, wall thickness, and eccentricity directly and simultaneously, without contact, utilizing a terahertz radiation unit, mirror, lenses, and a sensor for imaging analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If mechanical contact methods (two wheels or rollers) are used to measure flat product thickness, then the measurement can be obtained through direct contact, but mechanical wear and wheel bounce cause inaccuracies
Solution Approach 1:
The patent replaces the mechanical contact measurement system (two wheels or rollers) with a non-contact optical measurement system. The optical system uses light to measure the thickness of flat products without physical contact, thereby eliminating mechanical wear and wheel bounce that cause measurement inaccuracies and instability.
Solution Approach 2:
The patent introduces an optical field as an intermediary between the measurement system and the product. Instead of direct mechanical contact, light serves as the mediator to obtain thickness measurements, avoiding the harmful mechanical interactions while maintaining measurement capability.
2Reliability
If optical distance measuring devices are used to measure flat product thickness non-contact, then mechanical wear is avoided, but defocussing on product vibration or thickness change causes inaccuracies
Solution Approach 1:
The patent transitions from one-dimensional point measurement to two-dimensional area measurement by scanning the optical system across the product surface. This dimensional change allows comprehensive coverage and enables accurate thickness measurement even when local vibrations or thickness variations occur, as the scan captures multiple data points for analysis.
Solution Approach 2:
The patent implements continuous scanning measurement rather than discrete point measurement. The optical system continuously scans across the product surface, maintaining constant measurement action that captures dynamic conditions including vibrations and thickness changes, thereby preserving measurement accuracy throughout the scanning process.
3Measurement precision
If contact or optical methods are used to measure flat products, then thickness can be measured, but only along a narrow part of the product width and not the complete area
Solution Approach 1:
The patent extends measurement from a narrow linear path to a wide two-dimensional area by implementing a scanning system that moves across the entire product width. This dimensional expansion allows comprehensive coverage of the complete product area, capturing thickness variations across the full surface rather than limited to a narrow strip.
Solution Approach 2:
The patent employs a dynamic scanning measurement system that moves across the product surface rather than a static measurement point. This dynamic approach enables the measurement system to cover the entire product area by continuously scanning, adapting to different product widths and ensuring complete surface coverage.
4Reliability
If ultrasonic or radioactive methods are used to measure wall thickness without contact, then non-contact measurement is achieved, but special handling is required presenting health hazards
Solution Approach 1:
The patent replaces ultrasonic or radioactive measurement systems with an optical measurement system. This substitution eliminates the health hazards associated with radiation while maintaining the non-contact measurement capability. The optical system uses light instead of sound waves or ionizing radiation, providing a safe alternative for wall thickness measurement.
Solution Approach 2:
The patent changes the measurement parameter from ultrasonic frequency or radiation type to optical wavelength. This parameter change transitions the measurement mechanism to a safer domain where visible or near-visible light can penetrate and measure wall thickness without the harmful effects of ionizing radiation, thereby eliminating health hazards while preserving non-contact measurement functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides accurate, non-contact measurements of product dimensions, avoiding mechanical inaccuracies and health hazards, and allows for continuous monitoring of product specifications, optimizing material usage and reducing waste.
Implementation Method 1
The frequencies of THz radiation are located between infra-red and micro-waves and the wavelengths of THz radiation are in the range between 30 micrometres and 3 millimetres. Terahertz radiation (THz) has the advantage in that it behaves in a manner similar to that of white light, that is to say that the radiation can be reflected by mirrored surfaces but is able to penetrate and pass through dielectric or insulating materials such as rubber, paper and various plastics including polyethylene and the like.
Implementation Method 2
A further object of the present invention is to provide a measuring apparatus which uses a mirror to reflect a ray of terahertz radiation from a terahertz radiation unit thereby to produce a multiplicity of parallel rays of terahertz radiation which form a curtain of terahertz radiation through which a product may pass in motion
Implementation Method 3
A further object of the present invention is to provide a measuring apparatus which uses a lens to focus the rays at a sensor after passing through the product
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to apparatus for monitoring extruded products (10) moving in an inline extrusion process so as to effect quality control of the process by continuously measuring dimensional parameters and determining the existence of contaminants in the extrusion. The apparatus makes use of Terahertz radiation (13) which is adapted to provide a curtain of parallel rays of the radiation which is scanned across the product (10) as the product (10) passes therethrough in a linear manner. The composition of the omitted radiation received after the scanning process is subject to an imaging analysis to determine the dimensional parameters and contaminant free integrity of the extrusion process.