Terahertz Package Structure Using Resin Layers for Reliable Assembly
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Solution Overview
Problem
Current terahertz devices lack a modular package structure and efficient manufacturing methods, hindering their ability to effectively operate in the terahertz band for applications like communication, imaging, and measurement.
Innovation Solution
A terahertz device comprising a first and second resin layer, a conductor, a wiring layer, a terahertz element for converting terahertz waves and electric energy, and an external electrode, with a manufacturing method involving a support substrate, conductor formation, resin layer formation, wiring layer creation, terahertz element mounting, and external electrode formation to achieve a modular package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a modular package structure is implemented for terahertz devices, then manufacturing ease and reliability are improved, but device complexity increases
Solution Approach 1:
The device is divided into distinct functional layers including first and second resin layers, conductor layers, wiring layers, and the terahertz element itself. Each layer serves a specific function and can be manufactured and tested independently before final assembly, enabling modular manufacturing while maintaining overall device functionality.
Solution Approach 2:
The package structure employs nested layers where the terahertz element is embedded within the resin layers, which are in turn connected to conductor and wiring layers. The external electrode penetrates through the resin layers to connect with internal conductors, creating a nested configuration that organizes complex components in a structured manner.
2Reliability
If resin layers are used to support and protect the terahertz element, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Resin layers serve as intermediary materials between the terahertz element and external environment, providing mechanical support, protection, and electrical insulation. The resin layers mediate the connection between internal conductors and external electrodes, reducing stress concentration and protecting sensitive elements during manufacturing and operation.
Solution Approach 2:
The resin layers are designed with specific physical and electrical parameters including dielectric constant, loss tangent, and mechanical strength to optimize both reliability and manufacturability. By carefully selecting resin material parameters, the device achieves high reliability while maintaining reasonable manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable and efficient modular package structure for terahertz devices, enhancing their operational capabilities and manufacturing ease, while reducing thermal stress and improving reliability by using resin layers to support and protect the terahertz element.
Implementation Method 1
Elements currently known to oscillate a high-frequency electromagnetic wave of a frequency in the terahertz band include the one in which resonant tunneling diode (RTD) and micro-slot antennas are integrated
Data Source
AI summary
Terahertz device includes first resin layer, columnar conductor, wiring layer, terahertz element, second resin layer, and external electrode. Resin layer includes first resin layer obverse face and first resin layer reverse face. Columnar conductor includes first conductor obverse face and first conductor reverse face, penetrating first resin layer in z-direction. Wiring layer spans between first resin layer obverse face and first conductor obverse face. Terahertz element includes element obverse face and element reverse face, and converts between terahertz wave and electric energy. Second resin layer includes second resin layer obverse face and second resin layer reverse face, and covers wiring layer and terahertz element. External electrode, disposed offset in a direction first resin layer reverse face faces with respect to first resin layer, is electrically connected to columnar conductor. Terahertz element is conductively bonded to wiring layer.