Terahertz Packaging Structure With Reflective Frame for Noise Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current terahertz devices lack a suitable packaging structure for modularization, which affects their reliability and emission/reception quality due to exposure to environmental factors and interference.
Innovation Solution
A terahertz device with a packaging structure featuring a terahertz element, a conductive frame-shaped member with a reflective surface, and a sealing resin, allowing for modularization and improved emission/reception quality by reducing noise and increasing gain through resonant reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a terahertz element is exposed to the environment for modularization, then ease of manufacture and device assembly are improved, but reliability deteriorates due to environmental influences and interference
Solution Approach 1:
The terahertz element is nested within a packaging structure that includes a resin layer and a reflective plate. This nested configuration protects the element while maintaining modularization, as the entire packaged element can be treated as a single module for assembly purposes.
Solution Approach 2:
A reflective plate is introduced as an intermediary component between the terahertz element and the external environment. This plate reflects electromagnetic waves and prevents direct interference with the element, thereby improving reliability without compromising modularization capability.
2Reliability
If a packaging structure is added to protect the terahertz element, then reliability is improved, but device complexity increases
Solution Approach 1:
The packaging structure uses a nested configuration where the reflective plate is positioned within the resin layer, creating a compact multi-layer structure. This nesting approach protects the element while minimizing the overall increase in device complexity through space-efficient design.
Solution Approach 2:
The resin layer acts as a flexible protective shell that encapsulates the terahertz element and reflective plate. This thin-film approach provides comprehensive protection without adding significant structural complexity or bulk to the device.
3Power
If a reflective surface is added to improve emission and reception quality, then gain is increased through resonant reflection, but device complexity increases
Solution Approach 1:
The reflective plate is nested within the resin layer at a specific distance from the terahertz element, creating a resonant cavity structure. This nested configuration achieves enhanced emission and reception quality through resonant reflection while maintaining a compact design that limits complexity increase.
Solution Approach 2:
The reflective plate converts potentially harmful electromagnetic interference and wave dissipation into beneficial resonant reflection. By reflecting waves back toward the element, the structure transforms energy loss into gain, improving power efficiency without requiring complex active components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed packaging structure enhances the reliability and performance of terahertz devices by protecting the element from environmental influences and reducing interference, while improving the emission and reception of terahertz waves.
Implementation Method 1
the frame-shaped member has a reflective surface capable of reflecting the terahertz waves
Implementation Method 2
increasing gain through resonant reflection
Data Source
AI summary
A terahertz device includes a terahertz element, a sealing resin, a wiring layer and a frame-shaped member. The terahertz element that performs conversion between terahertz waves and electric energy. The terahertz element has an element front surface and an element back surface spaced apart from each other in a first direction. The sealing resin covers the terahertz element. The wiring layer is electrically connected to the terahertz element. A frame-shaped member is made of a conductive material and arranged around the terahertz element as viewed in the first direction. The frame-shaped member has a reflective surface capable of reflecting the terahertz waves.