Terahertz Radiating Element With Recessed Low-Permittivity Substrate
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Solution Overview
Problem
Existing devices for radiating or receiving electromagnetic waves in the terahertz range face challenges in achieving high radiation resistance and impedance matching between the radiating element and signal processing circuit, due to complex manufacturing processes and uneven substrate surfaces, which hinder sensitivity and efficiency.
Innovation Solution
A device with a substrate featuring a recess coated to reflect electromagnetic waves, where the metal portion is partially surrounded by air or a material with low relative permittivity, enhancing radiation resistance and impedance matching, and a manufacturing method that simplifies the process using a single substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the radiating element is placed on a semiconductor substrate with high relative permittivity, then the device can be manufactured using VLSI techniques, but the radiation resistance decreases
Solution Approach 1:
The substrate surface is segmented into a recess region and a flat region. The recess region is filled with a low-permittivity material or left as air, creating a localized region with different electromagnetic properties than the bulk semiconductor substrate. This segmentation allows the radiating element to experience a lower effective permittivity environment, improving radiation resistance while maintaining VLSI manufacturability.
Solution Approach 2:
Instead of changing the entire substrate properties, the invention applies a local modification by creating a recess and filling it with low-permittivity material only in the specific region where the radiating element is positioned. This local quality change optimizes the electromagnetic environment for radiation without affecting the overall substrate characteristics or manufacturing process.
2Speed
If fine patterning is applied to the signal processing circuit to increase effective frequency capability, then the frequency response improves, but the resistance of the signal processing circuit increases
Solution Approach 1:
The invention changes the electromagnetic environment parameter (permittivity) around the radiating element by introducing a low-permittivity material in the recess. This parameter change compensates for the increased circuit resistance caused by fine patterning, maintaining impedance matching and overall device performance at higher frequencies.
3Manufacturing precision
If a recess is formed in the substrate and filled with low-permittivity material, then radiation resistance increases, but the substrate surface becomes uneven
Solution Approach 1:
The invention addresses the surface flatness issue by adding a planarization layer on top of the recess structure. This layer fills in the topography variations and provides a flat upper surface, effectively moving the solution to another dimension (the vertical dimension) while preserving the beneficial electromagnetic properties in the horizontal dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high radiation resistance and impedance matching, enabling high sensitivity and efficient radiation, while simplifying the manufacturing process and allowing for integration of additional elements like microlenses.
Implementation Method 1
a recess (102) coated by a material that reflects electromagnetic waves
Implementation Method 2
a metal portion (103) that radiates or receives the electromagnetic wave
Data Source
AI summary
The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element.