Terahertz Wafer Inspection Probe Rail for Automatic Mode Switching
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Solution Overview
Problem
Current terahertz wave inspection methods for semiconductor wafers and packages face challenges in achieving reliable and efficient non-destructive, non-contact inspection due to limitations in probe alignment and signal detection, leading to inaccuracies and reduced inspection rates.
Innovation Solution
An inspection apparatus utilizing a terahertz frequency range of 0.1 THz to 10 THz, featuring a probe mount with first and second probes mounted on a curved rail, allowing for precise alignment and switching between transmission and reflection modes without manual operation, thereby enhancing inspection reliability and rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual probe alignment and switching is used, then operational flexibility is maintained, but inspection reliability decreases and contamination risk increases
Solution Approach 1:
The system performs self-alignment and self-switching through automated control. The probe mount automatically positions probes based on pre-stored coordinate data, and the controller automatically switches between probes based on inspection requirements, eliminating the need for manual alignment and switching operations.
Solution Approach 2:
Manual mechanical alignment and switching operations are replaced by an automated control system that uses stored coordinate data and electronic control signals to position and switch between probes, reducing human intervention and associated contamination risks.
2Adaptability or versatility
If multiple probes are used for transmission and reflection modes, then inspection comprehensiveness is improved, but device complexity increases
Solution Approach 1:
Multiple probes are configured to perform different inspection functions (transmission and reflection modes). Each probe can be positioned at specific locations to execute different inspection modes, allowing a single probe system to handle multiple inspection requirements without needing separate dedicated systems for each mode.
Solution Approach 2:
The inspection system is divided into multiple independent probes, each capable of performing specific inspection tasks. The probe mount segments the positioning function, allowing individual probes to be independently positioned and activated based on inspection requirements, simplifying the control logic for each individual probe.
3Productivity
If probes remain in inspection position continuously, then inspection rate is maintained, but probe damage and contamination increase
Solution Approach 1:
The probe positions are dynamically adjusted based on inspection requirements. After completing an inspection task, probes are automatically moved to predetermined storage positions that are apart from the active inspection area. This dynamic positioning reduces continuous contact between probes and the inspection target, minimizing wear and contamination while maintaining high inspection rates through rapid repositioning.
Solution Approach 2:
Storage positions for probes are pre-determined and prepared in advance. When probe replacement or repositioning is needed, the system automatically moves probes to these pre-configured storage locations, eliminating the need for manual intervention and ensuring probes are properly protected between inspection cycles.
4Productivity
If automated probe switching is implemented, then inspection efficiency is improved, but alignment precision requirements increase
Solution Approach 1:
The precise coordinates for probe positioning are pre-calculated and stored in the controller before operation. This preliminary preparation of position data ensures that when automated switching occurs, the probes are rapidly and accurately positioned at the correct locations without requiring complex real-time alignment adjustments, thus maintaining both speed and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves the reliability and efficiency of semiconductor device inspection by enabling precise alignment and automatic switching between probes, preventing damage and contamination, and allowing for real-time inline inspection without manual intervention.
Implementation Method 1
an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of about 0.1 terahertz (THz) to 10 THz
Implementation Method 2
a first probe configured to detect the inspection ray transmitted through the wafer
Data Source
AI summary
An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.