Terminal Air-Duct Cooling Layout for High-Load Heat Dissipation
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Solution Overview
Problem
Current smartphone heat dissipation technologies rely on passive methods, leading to inefficient heat dissipation, especially in high-load scenarios, causing devices to overheat and affect performance.
Innovation Solution
Implement an active heat dissipation system within the terminal device, incorporating a housing, circuit board, air duct, heat dissipation member, and fan apparatus, with thermally conductive media and electromagnetic shielding to enhance heat conduction and exchange, utilizing flexible materials to fill gaps and improve thermal connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If passive heat dissipation is used, then device structure is simple, but heat dissipation efficiency is low
Solution Approach 1:
The patent transitions from static passive heat dissipation to dynamic active heat dissipation by introducing a fan apparatus that actively drives airflow through the air duct system. The fan dynamically adjusts air flow rates to match thermal loads, with the airflow path configurable between first and second directions based on operational conditions, thereby resolving the contradiction between structural simplicity and heat dissipation efficiency.
Solution Approach 2:
The patent introduces an air duct as an intermediary component that mediates heat transfer between the heat generation component and the external environment. The air duct includes a first wall and second wall forming a controlled channel, with the heat dissipation member positioned within it. This intermediary structure enables efficient thermal coupling while maintaining a relatively compact device form factor.
2Speed
If heat dissipation path is shortened, then cooling speed increases, but component arrangement becomes more difficult
Solution Approach 1:
The patent utilizes the thickness direction (Z-axis) of the terminal device to shorten the heat dissipation path. The heat dissipation member is positioned in the air duct such that its projection in the thickness direction coincides with the heat generation component's projection, creating a direct vertical thermal pathway. This dimensional arrangement achieves rapid cooling while maintaining a compact planar footprint, resolving the contradiction between cooling speed and component arrangement difficulty.
3Loss of energy
If thermally conductive medium is used to fill gaps, then heat conduction improves, but manufacturing complexity increases
Solution Approach 1:
The patent specifies that the thermally conductive medium must have flexibility to fully fill gaps between the circuit board and air duct. By selecting materials with appropriate rheological parameters (flexibility, viscosity), the system achieves complete gap filling through the medium's ability to deform and conform to irregular spaces. This parameter-based approach improves heat conduction efficiency while keeping the manufacturing process relatively simple, as the flexible medium can be applied as a paste or gel that self-levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The active heat dissipation system achieves efficient cooling of heat-generating components, ensuring device performance in high-load conditions and enhancing user experience by quickly dissipating heat.
Implementation Method 1
heat conducted by the heat generation component
Implementation Method 2
heat of the heat dissipation member is dissipated to an exterior of the housing sequentially through the air outlet and the air outlet hole via the airflow
Implementation Method 3
The fan apparatus is disposed at a position that is in the air duct and that is close to the air inlet, to guide an airflow to the heat dissipation member
Implementation Method 4
heat of the heat generation component is conducted to the heat dissipation member sequentially through the first thermally conductive medium and a side wall of the air duct
Data Source
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AI summary
A terminal device is provided, including a housing, a circuit board, a heat generation component, an air duct, a heat dissipation member, and a fan apparatus. The housing is provided with an air inlet hole and an air outlet hole. The circuit board is disposed in the housing. The heat generation component is disposed on the circuit board. The air duct is disposed between the housing and the circuit board. The air duct includes an air inlet and an air outlet. The air inlet communicates with the air inlet hole. The air outlet communicates with the air outlet hole. The heat dissipation member is disposed at a position that is in the air duct and that is close to the air outlet, to receive heat conducted by the heat generation component. The fan apparatus is disposed at a position that is in the air duct and that is close to the air inlet, to guide an airflow to the heat dissipation member, so that heat of the heat dissipation member is dissipated to an exterior of the housing sequentially through the air outlet and the air outlet hole via the airflow. In this application, a heat dissipation system including the heat dissipation member, the fan apparatus, the air duct, and the like is disposed inside the terminal device. This can implement active heat dissipation to achieve efficient cooling of the heat generation component, thereby enabling the terminal device to achieve good performance during running in a high-load scenario.